Thermal Stability and Interface Improvement of Thin Nisige by C+ Ion Implantation
B. Zhang,W. Yu,Q. T. Zhao,D. Buca,B. Hollaender,J-M Hartmann,M. Zhang,X. Wang,S. Mantl
DOI: https://doi.org/10.1109/iitc.2011.5940344
2011-01-01
Abstract:In this work, we address the effect of C+ ion implantation on the formation of nickel-germanosilicide NiSi0.8Ge0.2 on relaxed Si0.8Ge0.2 layers. The layer morphology and sheet resistance are investigated as a function of the C+ implantation dose and annealing temperature. The presence of C atoms increases the NiSiGe thermal stability by about 200°C. We demonstrate that the carbon atoms retard the growth of germanosilicide layers, stabilize the NiSiGe phase and, due to C segregation at grain boundaries and interface during annealing, smooth the Ni Si0.8Ge0.2/Si0.8Ge0.2 interface.