Study on the Strain in SiGeC Alloy Films Grown on Si Substrate by CVD
DENG Yongzheng,KONG Yuechan,JIANG Ning,ZHENG Youdou,ZHU Shunmin,HAN Ping,SHI Yi,ZHANG Rong
DOI: https://doi.org/10.3969/j.issn.1000-3819.2005.04.004
2005-01-01
Abstract:In this paper,we studied the strain in SiGeC films grown on Si substrate by RTP/VLP-CVD.Raman spectra and AES were used to analyze the strain in SiGeC films.It is shown that there are two carbon incorporation modes in the SiGeC films:substitutional mode and interstitial mode.The majorities of C atoms are in interstitial mode,while the minorities of substitutional C atoms modulate the strain in SiGeC films sufficiently.Because of high temperature of growth,the strain in SiGeC films is partially relaxed.Compared to the SiGe films with the same Ge composition on Si substrate,due to the substitutional C atoms,the SiGeC films have much lower strain and higher critical thickness,which means that SiGeC films with larger thickness and better quality than SiGe films can be grown on Si substrate.