The growth and quality evaluation of strained Si material with multilayer structure

Renrong LIANG,Jing WANG,Yang XU,Jun XU,Zhijian LI
DOI: https://doi.org/10.3321/j.issn:1005-3093.2007.01.012
2007-01-01
Abstract:The strained Si material has been fabricated on a relaxed Si_(0.7)Ge_(0.3)/graded Si_(1-x)Ge_x/Si substrate multilayer structure using a reduced pressure chemical vapor deposition (RPCVD) process.In the graded Si_(1-x)Ge_x layer,the mole fraction of Ge increases linearly from 0 to 0.2.The multilayer structure has been evaluated using various analysis techniques.The results showed that the root mean square (rms) of strained Si surface roughness is 4.12 nm,the strain in the strained Si cap layer is about 1.2%,and the threading dislocation density is about 4×10~4cm~(-2).Further rapid thermal annealing (RTA) experiment demonstrated that the strain state and surface morphology of the strained cap Si layer are almost unchanged even suffered from the high thermal budget.It will be particularly useful for the fabrication of strained Si devices.
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