Thermal Annealing Effects on a Compositionally Graded SiGe Layer Fabricated by Oxidizing a Strained SiGe Layer

Kunhuang Cai,Cheng Li,Yong Zhang,Jianfang Xu,Hongkai Lai,Songyan Chen
DOI: https://doi.org/10.1016/j.apsusc.2008.02.075
IF: 6.7
2008-01-01
Applied Surface Science
Abstract:Thermal annealing effects on a thin compositionally graded SiGe buffer layer on silicon substrate fabricated by oxidizing a strained SiGe layer are investigated with X-ray diffraction, ultraviolet Raman spectra and atomic force microscopy. Interestingly, we found that the surface roughness and the threading dislocation densities are kept low during the whole annealing processes, while the Ge concentration at the oxidizing interface decreases exponentially with annealing time and the strain in the layer is only relaxed about 66% even at 1000°C for 180min. We realized that the strain relaxation of such a compositionally graded SiGe buffer layer is dominated by Si–Ge intermixing, rather than generation and propagation of misfit dislocations or surface undulation.
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