Isochronal and Isothermal Annealing Effects on Si1-xGex Thin Film by Ion Beam Sputtering

Guangwei Wang,Guoping Ru,Jianmin Zhang,Jihua Cao,Bingzong Li
DOI: https://doi.org/10.3969/j.issn.1674-4926.2006.05.016
2006-01-01
Abstract:Polycrystalline Si_ 1-xGe_x thin film is deposited on n-Si(100) and SiO_2 substrates respectively by ion beam sputtering.The Ge fraction in the Si_ 1-xGe_x layer is determined to be 0.15~0.16 by Auger electron spectroscopy.The samples are annealed in a conventional furnace at different temperatures for different durations to investigate temperature and time effects on crystallinity.Phase identification is performed by X-ray diffractometry.It is found that the Si_ 1-xGe_x film has a higher crystallinity on n-Si than on SiO_2 under identical annealing conditions.The dependences of the average grain size on annealing temperature and time are exponential and parabolic functions, respectively,as determined by curve fitting.Thus the crystallization process of ion beam sputtered Si_ 1-xGe_x film may be controlled by grain growth.
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