A New Method of Fabricating Strained Silicon Materials

Yang Zongren,Liang Renrong,Xu Jun
DOI: https://doi.org/10.1016/s1001-0521(08)60049-2
2006-01-01
Abstract:Strain-relaxed SiGe virtual substrates are of great importance for fabricating strained Si materials. Instead of using graded buffer method to obtain fully relaxed SiGe film, in this study a new method to obtain relaxed SiGe film and strained Si film with much thinner SiGe film was proposed. Almost fully relaxed thin SiGe buffer layer was obtained by Si/SiGe/Si multi-structure oxidation and the SiO2 layer removing before SiGe regrowth. Raman spectroscopy analysis indicates that the regrown SiGe film has a strain relaxation ratio of about 93 % while the Si cap layer has a strain of 0. 63 %. AFM shows good surface roughness. This new method is proved to be a useful approach to fabricate thin relaxed epilayers and strain Si films.
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