Thin Highly-Relaxed SiGe Induced by Ion Implantion into the Epitaxial Substrates

Xiangdong Xu,Fulong Guo,Wei Zhou,Zhihong Liu,Zhaojian Zhang,Xiyou Li,Wei Zhang,Peixin Qian
DOI: https://doi.org/10.3969/j.issn.1674-4926.2006.z1.034
2006-01-01
Abstract:We propose an approach for preparation of thin highly-relaxed SiGe by combining ion implantation and UHV/CVD techniques. The as-yielded materials are analyzed by micro-Raman spectroscopy and atomic force microscope. The results reveal that large area, thin (100 nm) SiGe layer with high relaxation (94%) is thus successfully prepared. Selective chemical etching of SiGe, with the etching rate of 25.4 nm/min, is also performed to study the mechanism. It is found that a strained-Si layer exists at the interface between the epi-SiGe and Si substrate, which is believed to be resulted from both ion implantation and formation of a relaxed-SiGe layer.
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