Elastically Relaxed Free-standing Strained-Si Nanomembranes

Michelle M. Roberts,Levente J. Klein,Don E. Savage,Keith A. Slinker,Mark Friesen,George Celler,Mark A. Eriksson,Max G. Lagally
DOI: https://doi.org/10.1038/nmat1606
2006-06-16
Abstract:Strain plays a critical role in the properties of materials. In silicon and silicon-germanium, strain provides a mechanism for control of both carrier mobility and band offsets. In materials integra-tion, strain is typically tuned through the use of dislocations and elemental composition. We demonstrate a versatile method to control strain, by fabricating membranes in which the final strain state is controlled by elastic strain sharing, i.e., without the formation of defects. We grow Si/SiGe layers on a substrate from which they can be released, forming nanomembranes. X-ray diffraction measurements confirm a final strain predicted by elasticity theory. The effec-tiveness of elastic strain to alter electronic properties is demonstrated by low-temperature longi-tudinal-Hall effect measurements on a strained-Si quantum well before and after release. Elastic strain sharing and film transfer offers an intriguing path towards complex, multiple-layer struc-tures in which each layer's properties are controlled elastically, without the introduction of unde-sirable defects.
Mesoscale and Nanoscale Physics
What problem does this paper attempt to address?
The key problem that this paper attempts to solve is: how to control the strain states of silicon (Si) and silicon - germanium (SiGe) thin films through elastic strain sharing without introducing defects, thereby optimizing their electronic properties. Specifically, the author proposes a new method to effectively control the strain state of materials by fabricating freely - floating strained - Si nanomembranes. ### Main problems and solutions 1. **Limitations of traditional methods**: - Traditional strain regulation methods rely on dislocations and elemental composition adjustment, which will lead to adverse defects in the material. - The presence of dislocations will reduce carrier mobility and limit the degree of design freedom. - Surface roughness (cross - hatch) will be generated during the strain release process, requiring additional polishing and cleaning steps. 2. **Proposed solutions**: - **Elastic strain sharing**: By growing Si/SiGe layers on an ultrathin silicon - on - insulator (SOI) substrate and then using hydrofluoric acid (HF) etching to remove the oxide layer, a freely - floating nanomembrane is released. - **Defect - free strain control**: This method avoids the formation of dislocations, thus eliminating the defect problems in traditional methods. - **Transferability**: The released nanomembrane can be transferred to any new substrate that is insoluble in water, further expanding the application range. 3. **Verification methods**: - Use X - ray diffraction (XRD) measurement to confirm that the final strain state is consistent with the prediction of elastic theory. - Verify the influence of strain on the electronic properties of quantum wells through low - temperature longitudinal Hall effect measurements. ### Key formulas The strain distribution mentioned in the paper can be described by the following formulas: \[ \epsilon_{\text{Si}} = \frac{\epsilon_m (1 - \nu_{\text{Si}})}{(1 - \nu_{\text{Si}}) + \left(\frac{E_{\text{Si}}}{E_{\text{SiGe}}}\right) \left(\frac{h_{\text{Si}}}{h_{\text{SiGe}}}\right) (1 - \nu_{\text{SiGe}})} \] \[ \epsilon_{\text{SiGe}} = \frac{\epsilon_m (1 - \nu_{\text{SiGe}})}{(1 - \nu_{\text{SiGe}}) + \left(\frac{E_{\text{SiGe}}}{E_{\text{Si}}}\right) \left(\frac{h_{\text{SiGe}}}{h_{\text{Si}}}\right) (1 - \nu_{\text{Si}})} \] where: - \(\epsilon_m\) is the mismatch strain. - \(\epsilon_{\text{Si}}\) and \(\epsilon_{\text{SiGe}}\) are the strains of Si and SiGe layers respectively. - \(E_{\text{Si}}\) and \(E_{\text{SiGe}}\) are the Young's moduli of Si and SiGe respectively. - \(\nu_{\text{Si}}\) and \(\nu_{\text{SiGe}}\) are the Poisson's ratios of Si and SiGe respectively. - \(h_{\text{Si}}\) and \(h_{\text{SiGe}}\) are the thicknesses of Si and SiGe layers respectively. Through these formulas, the author shows how to achieve the ideal strain distribution through elastic strain sharing and verifies the consistency between experimental results and theoretical predictions.