Quantitative Strain Characterization of SiGe Heterostructures by High-Resolution Transmission Electron Microscopy

C. W. Zhao,Y. M. Xing,J. Z. Yu,G. Q. Han
DOI: https://doi.org/10.1016/j.physb.2010.05.018
IF: 2.988
2010-01-01
Physica B Condensed Matter
Abstract:We report the quantitative strain characterization in semiconductor heterostructures of silicon–germaniums (Si0.76Ge0.24) grown on Si substrate by an ultra-high vacuum chemical vapor deposition system. The relaxed SiGe virtual substrate has been achieved by thermal annealing of the SiGe film with an inserted Ge layer. Strain analysis was performed using a combination of high-resolution transmission electron microscopy and geometric phase analysis.
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