Abstract:Comprehensive electrothermal analysis of multilevel interconnects under electrostatic discharge (ESD) stress is carried out using the proposed nonlinear time-domain finite-element method (FEM). The technological, structural, and material parameters used in the analysis correspond to the advanced CMOS process of 90-, 65-, 45, and 32-nm nodes assessed by the International Technology Roadmap for Semiconductors. In order to enhance the computation efficiency and to reduce the memory cost, the preconditioned conjugated gradient technique combined with the element-by-element approximate factorization method is introduced to handle the sparsematrices formed by FEM. The nonlinear material parameters including the temperature-dependent electrical and thermal conductivities are treated rigorously. The transient temperature distributions, the maximum temperatures, and the temperature rise time of 3- and 4-level interconnect structures under the injection of ESD pulses with various waveforms are obtained and discussed.

Electro-thermal Analysis of a 65 nm Channel MOSFET Under The HPEMP

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Analysis of Electro-Thermal-Stress Failure of the Ldmos Fet under Hpm Pulses

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Electro-Thermal-Stress analysis of a LDMOS FET Breakdown under High Power Microwave pulses

Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method

Concurrent Analysis of Self-Heating Effect and Thermal Stress in Partially Insulated Field Effect Transistors (Pifets)

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)

Synergistic Effects Simulation of MOSFET by Control Volume Finite Element Method

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Experimental Investigation and Analysis of the LDMOS FET Breakdown Under HPM Pulses

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation.

Electrothermal Characterization of TFTs under the Impact of an EMP

Transient Thermal Analysis of GaN Heterojunction Transistors (HFETs) for High-Power Applications

A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs.