Abstract:Electro-thermo-stress (ETS) failure of bonding wire array in a laterally diffused metal oxide semiconductor (LDMOS) field-effect transistor (FET)-based power amplifier during its high power’s ruggedness experiment is investigated in this paper. A special measurement system is at first set up to get reliability of the bonding wire array, where a microscope is used to capture its fractures. The temperature distribution of the LDMOSFET die surface and bonding wire array is also captured by a thermal infrared scanner to investigate the principle underlying the failure of ETS fractures. Simulation studies are also performed. The temperature distribution is closely related to the profiles of the bonding wire array. Numerical methods are employed to calculate the bonding wire array, and the temperature distributions are demonstrated by using our finite-element method code. It also works well in solving the transient temperature of the bond wire array with the stationary current and the heat source from the silicon region. The simulated thermal results agree well with the testing results. Finally, an improved LDMOS design in optimizing the bonding wire profile is proposed. This research can serve as a guide for the design of an LDMOS PA with enhanced reliability.

Analysis of Electro-Thermal-Stress Failure of the Ldmos Fet under Hpm Pulses

Electro-Thermal-Stress analysis of a LDMOS FET Breakdown under High Power Microwave pulses

Experimental Investigation and Analysis of the LDMOS FET Breakdown Under HPM Pulses

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Electro-thermal-stress interaction of GaN HEMT breakdown induced by high power microwave pulses

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers

Improvement of Thermal and Mechanical Reliability of a LDMOS FET Using Graphene

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method

Concurrent Analysis of Self-Heating Effect and Thermal Stress in Partially Insulated Field Effect Transistors (Pifets)

Study on Electro-Thermo-Mechanical Responses of Bonding Wires Arrays Used for the Package Design of Ldmosfet-Based Rf Amplifier

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Investigation on Thermo-Mechanical Responses in High Power Multi-Finger AlGaN/GaN HEMTs

Investigation on conductive electromagnetic pulse (EMP) effects on the breakdown of GaAs MESFET-built power amplifiers (PA)

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Synergistic Effects Simulation of MOSFET by Control Volume Finite Element Method

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)