Abstract:Electro-thermo-stress (ETS) failure of bonding wire array in a laterally diffused metal oxide semiconductor (LDMOS) field-effect transistor (FET)-based power amplifier during its high power’s ruggedness experiment is investigated in this paper. A special measurement system is at first set up to get reliability of the bonding wire array, where a microscope is used to capture its fractures. The temperature distribution of the LDMOSFET die surface and bonding wire array is also captured by a thermal infrared scanner to investigate the principle underlying the failure of ETS fractures. Simulation studies are also performed. The temperature distribution is closely related to the profiles of the bonding wire array. Numerical methods are employed to calculate the bonding wire array, and the temperature distributions are demonstrated by using our finite-element method code. It also works well in solving the transient temperature of the bond wire array with the stationary current and the heat source from the silicon region. The simulated thermal results agree well with the testing results. Finally, an improved LDMOS design in optimizing the bonding wire profile is proposed. This research can serve as a guide for the design of an LDMOS PA with enhanced reliability.

Electro-Thermal-Stress analysis of a LDMOS FET Breakdown under High Power Microwave pulses

Experimental Investigation and Analysis of the LDMOS FET Breakdown Under HPM Pulses

Analysis of Electro-Thermal-Stress Failure of the Ldmos Fet under Hpm Pulses

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Electro-thermal-stress interaction of GaN HEMT breakdown induced by high power microwave pulses

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Investigation on conductive electromagnetic pulse (EMP) effects on the breakdown of GaAs MESFET-built power amplifiers (PA)

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

Electrothermal breakdown of an intentional electromagnetic pulse injected into Ku-band gaas Mesfet-based low noise amplifier(LNA)

Improvement of Thermal and Mechanical Reliability of a LDMOS FET Using Graphene

Study on Electro-Thermo-Mechanical Responses of Bonding Wires Arrays Used for the Package Design of Ldmosfet-Based Rf Amplifier

Breakdown Predictions of Microstrip Interconnects and Coplanar Waveguide-Built Devices in the Presence of HP-EMPs

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)

Experiments and Comparisons of Power to Failure for SiGe-Based Low-Noise Amplifiers under High-Power Microwave Pulses

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Synergistic Effects Simulation of MOSFET by Control Volume Finite Element Method

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation.

Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method