Abstract:Both transient temperature and thermal stress responses in high power multi-finger AlGaN/GaN high electron mobility transistors (HEMTs), caused by their self-heating effects, are characterized in the present study. Instead of using commercial software, self-developed algorithm based on hybrid time-domain finite element method (TD-FEM) is applied for thermo-mechanical co-simulation of such 3-D structure. The temperature-dependent properties of most constitutive parameters of all materials involved, in particular for electrical conductivities, thermal conductivities, thermal expansion coefficients, and Young's modulus, are described by several sets of nonlinear polynomial expressions. The algorithm accuracy is validated in detail, with good agreement achieved in comparison with the commercial software COMSOL. It is believed that this study will be useful for effectively evaluating the reliability and lifetime of AlGaN/GaN HEMTs and their monolithic microwave integrated circuits (MMIC) used in high power communication systems and radars. (C) 2013 Elsevier Ltd. All rights reserved.

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)

Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation.

Transient Thermal Analysis of GaN Heterojunction Transistors (HFETs) for High-Power Applications

Numerical investigation on thermal characteristics of GaN HFETs for high power applications

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

Electro-Thermal-Stress analysis of a LDMOS FET Breakdown under High Power Microwave pulses

Investigation on conductive electromagnetic pulse (EMP) effects on the breakdown of GaAs MESFET-built power amplifiers (PA)

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Numerical investigation on thermal characteristics of BJTs under the impact of an EMP

Analysis of Electro-Thermal-Stress Failure of the Ldmos Fet under Hpm Pulses

Electro-thermal-stress interaction of GaN HEMT breakdown induced by high power microwave pulses

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Electrothermal Characterization of TFTs under the Impact of an EMP

Electrothermal breakdown of an intentional electromagnetic pulse injected into Ku-band gaas Mesfet-based low noise amplifier(LNA)

Experimental Investigation and Analysis of the LDMOS FET Breakdown Under HPM Pulses

Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Investigation on Thermo-Mechanical Responses in High Power Multi-Finger AlGaN/GaN HEMTs

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Transient Characterization of Power Divider Response Illuminated by a High-Power EMP

Breakdown Predictions of Microstrip Interconnects and Coplanar Waveguide-Built Devices in the Presence of HP-EMPs