Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Fanzhi Kong,Wenyan Yin,Junfa Mao,Qinghuo Liu
DOI: https://doi.org/10.1109/APS.2008.4619420
2008-01-01
Abstract:Time-dependent electro-thermo-mechanical transient responses of interwafer interconnects under the impact of an EMP are investigated in this paper. The mathematical methodology is based on hybrid physical field time-domain finite element method (FEM), in which all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of materials involved are treated rigorously. Therefore, three-dimensional (3-D) temperature and thermal stress distributions of one- and two-level metal bridge-vias in multi-level interwafer interconnects used for high-density integration of ICs are captured numerically and discussed.
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