Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

Fan-Zhi Kong,Wen-Yan Yin,Jun-Fa Mao,Qing Huo Liu
DOI: https://doi.org/10.1109/apmc.2008.4958006
2008-01-01
Abstract:In this paper, a hybrid physical simulation method is implemented so as to characterize transient temperature and stress responses in wire bonding interconnects in high-density 3-D ICs under the impact of an EMP. Our self-developed algorithm is based on time-domain FEM, which is capable of handling interactions and coupling among different physical fields. In particular, temperature-dependent nonlinearities of electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of all materials involved are treated rigorously.
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