Abstract:Based on several extended formulas to determine all frequency- and temperature-dependent distributed parameters of on-chip coupled asymmetrical and symmetrical interconnects on silicon substrates, the electromagnetic-thermal characteristics of interconnects were investigated in detail, including 1) wideband series impedances and shunt conductances, 2) conductive and dielectric attenuation constants of even(c) and odd (pi)-mode, 3) pulse waveform distortion and crosstalk, and 4) average power handling capability (APHC). In these investigations, a set of modified formulas were proposed to determine the mutual conductance and capacitance of asymmetrical configuration. Appropriate thermal models were employed to evaluate the rise in temperature of metal interconnects, where the lateral heat dissipation was taken into account for different spacings between two interconnects. Parametric calculations were performed to capture the hybrid effects of all geometric and physical parameters of metal interconnects, such as line thickness, line conductivity, and silicon conductivity. All numerical examples are believed to be useful in the design of (a)symmetrical interconnects for digital and radio frequency circuits.

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)

Electrothermal Characterization of TFTs under the Impact of an EMP

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Electrothermal modelling of through silicon via (TSV) interconnects

Fast transient electro-thermal simulation of on-chip interconnects in the presence of ESD pulses

Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP

Transient Electro-Thermal Analysis of On-Chip Interconnects in the Presence of ESD Pulses Using DGTD Method

Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

An Electrothermal Model of Interconnects Based on a Transmissionline Network

Electrothermal Characterization of Multilevel Cu-Graphene Heterogeneous Interconnects in the Presence of an Electrostatic Discharge (ESD)