Abstract:The synergistic effects between total ionizing dose (TID) and transient dose rate (TDR) effects are explored. To implement the analysis, a stable 3D parallel numerical scheme is specially developed. Using the control volume finite element tearing and interconnect (CV-FETI) method, the discontinuous boundary conditions can be included with the usual numerical properties. Newton's method is employed to overcome the nonconvergence brought by the nonlinear property of the drift- diffusion model. Compared to with the commercial COMSOL Multiphysics software, our CV-FETIM shows strong numerical stability on unstructured meshes. The proposed method is validated by comparing the numerical results with those calculated using commercial software. Then, this new solver is applied to simulate MOSFET, STI-based LDMOSFET, and FinFET. By adjusting the dose rate, oxide traps, and interface traps, the independent TID, independent TDR, and TID-TDR synergistic effects are investigated. On picosecond or nanosecond timescales, the duration, amplitude, and decline rate of the radiation-induced photocurrent are studied. Moreover, the influence of interface traps on different surfaces is compared. The numerical results indicated that the developed numerical scheme possesses good stability, accuracy, and applicability.

Transient Electro-Thermal Analysis of On-Chip Interconnects in the Presence of ESD Pulses Using DGTD Method

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Transient Electromagnetic-thermal Co-Simulation Based on DGTD Method

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Large-Scale Parallel DGTD and FETD Method for Transient Microwave Heating

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

High-order Discontinuous Galerkin Method for Vacuum Electron Device Modeling

Discontinuous Galerkin Time Domain Electric Field Integral Equation Method For Solving Non-Conformal Structures

Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Implementation Of Temperature Dependent Contact Resistance Model For The Analysis Of Deep Submicron Devices Under Esd

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

A Stabilized Numerical Scheme to Simulate Synergistic Effect of TID and TDR in Semiconductor Devices

Transient Modelling of Loss and Thermal Dynamics in Power Semiconductor Devices

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

A Novel and Powerful TCAD Methodology to Evaluate Performance of ESD Protection Devices

Thermal-aware electrical analysis of high-speed interconnect

Two-Dimensional Discontinuous Galerkin Time-Domain Method for Modeling of Arbitrarily Shaped Power-Ground Planes

Analyse of Protection Devices' Speed Performance against ESD under CDM Using TCAD

Parallel Higher Order DGTD and FETD for Transient Electromagnetic-Circuital-Thermal Co-Simulation