Abstract:A comprehensive electro-thermo-mechanical transient investigation is carried out to characterize time-dependent thermal and mechanical responses of metal wire bonding interconnects, as they suffer from the impact of an electromagnetic pulse (EMP) with different current or voltage waveforms. In our mathematical implementation, a hybrid time-domain finite element method is applied to simulate mutual interactions among electrical, thermal, and mechanical fields, with all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of materials being treated appropriately. The developed algorithm is partially validated by computing transient temperature and thermal stress of other interconnects with good agreement with reference results. Parametric studies are performed to show the effects of EMP waveform parameters, geometrical and physical parameters of various wire bonding interconnects on their transient thermal and mechanical responses, thus providing basic information for their electromagnetic protection so as to suppress the impact of an intentional EMP.

Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

An Electro-Thermal Analysis of Lateral Double-diffused MOSFET(LDMOS) Using FEM

Thermal Transient Response Of Gaas Fets Under Intentional Electromagnetic Interference (Iemi)

Analysis of the Thermal Effects of Gaasfets under the High-Power Electromagnetic Pulses

Electro-Thermal-Stress analysis of a LDMOS FET Breakdown under High Power Microwave pulses

Numerical investigation on thermal characteristics of BJTs under the impact of an EMP

Analysis of Electro-Thermal-Stress Failure of the Ldmos Fet under Hpm Pulses

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Experimental Investigation and Analysis of the LDMOS FET Breakdown Under HPM Pulses

Electrothermal Characterization of TFTs under the Impact of an EMP

Synergistic Effects Simulation of MOSFET by Control Volume Finite Element Method

Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Hybrid Physical Field Simulation: Transient Electro-Thermo-Mechanical Responses Of Interwafer Interconnects Under The Impact Of An Emp

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Electrothermal breakdown of an intentional electromagnetic pulse injected into Ku-band gaas Mesfet-based low noise amplifier(LNA)

Investigation on conductive electromagnetic pulse (EMP) effects on the breakdown of GaAs MESFET-built power amplifiers (PA)

Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation.

TRANSIENT RESPONSES OF SOME ANTENNAS UNDER THE IMPACT OF AN INTENTIONALLY INCIDENT HIGH-POWER ELECTROMAGNETIC PULSE