Abstract:Tungsten carbide (WC), celebrated for its exceptional strength, hardness, and chemical inertness, serves as an exemplary reinforcement for copper (Cu) matrix composite (CMC) coatings, significantly enhancing their wear and corrosion resistance. However, the inherent poor wettability and interfacial bonding between WC and Cu during the cold spray additive manufacturing process pose challenges to further performance improvement of these coatings. This study investigates cold-sprayed CMC coatings reinforced with WC particles, both with and without an electroless plated cobalt (Co) shell (Co@WC; at 10 wt.% and 20 wt.%), focusing on their microstructure, mechanical properties, tribological behavior, and electrochemical corrosion resistance. The findings indicate a reduction in CMC coatings` porosity and mean free path (MFP) of reinforcement particles with increasing reinforcement content. Despite slight Co shell damage during deposition, ceramic retention is notably enhanced, reaching up to 149.3%. The microhardness and wear resistance of CMC coating are improved with decreased MFP and increased ceramic content. Compared to the Cu coating, the microhardness of CMC coatings escalates by up to 32.9% (151.8HV0.1), and the specific wear rate is dramatically reduced by up to 84.2%. The Co shell effectively prevents the detachment of Co@WC particles, thereby enhancing the bending and wear resistance. Electrochemical corrosion tests, encompassing open circuit potential (EOCP), polarization curve, and electrochemical impedance spectroscopy (EIS), indicate that lower porosity, high ceramic content and the Co shell substantially boost the corrosion resistance of the CMC coating. Specifically, the coating with 20 wt.% Co@WC (Cu20(Co@WC)) demonstrates superior corrosion resistance compared to the Cu coating, hinting at the potential for further enhancement with increased ceramic content.

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Direct copper electrodeposition on novel CoMo diffusion barrier

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Effect of Coxmoy As Single Barrier Layer on Properties of Directly Electroplated Copper Films

Modifying Element Diffusion Pathway by Transition Layer Structure in High-Entropy Alloy Particle Reinforced Cu Matrix Composites

Study on CMP of Copper Interconnect with Novel Mo-Based Diffusion Barriers

Study of A Single Layer Ultrathin Como Film As A Direct Plateable Adhesion/Barrier Layer for Next Generation Interconnect

Study of the sputtered Mo/TaN and Mo-Ta thin film as diffusion barrier for copper metallization

The Oxygen Barrier Properties of CoxMoy Diffusion Barrier for Cu Interconnect

Investigation of Co/TaN Bilayer As Cu Diffusion Barrier

Study of Direct Cu Electrodeposition on Ultra-Thin Mo for Copper Interconnect

Electrodeposition of Cu on CoTa Barrier in the Alkaline CuSO4-Ethylenediamine Solution

Cold-sprayed Cu Matrix Composite Coatings with Core-Shell Structured Co@WC Reinforcements on Q235 Steel

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The Inhibition of Enhanced Cu Oxidation on Ruthenium∕Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru

Fabrication of Potential NiMoP Diffusion Barrier/seed Layers for Cu Interconnects Via Electroless Deposition

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Electroless Ni–Mo–P Diffusion Barriers with Pd-activated Self-Assembled Monolayer on SiO2

Crystallinity of Co-P coating on microstructure and mechanical properties of Co-Sn intermetallic compounds at Sn-Ag/Co-P/Cu Interface