Abstract:Tungsten carbide (WC), celebrated for its exceptional strength, hardness, and chemical inertness, serves as an exemplary reinforcement for copper (Cu) matrix composite (CMC) coatings, significantly enhancing their wear and corrosion resistance. However, the inherent poor wettability and interfacial bonding between WC and Cu during the cold spray additive manufacturing process pose challenges to further performance improvement of these coatings. This study investigates cold-sprayed CMC coatings reinforced with WC particles, both with and without an electroless plated cobalt (Co) shell (Co@WC; at 10 wt.% and 20 wt.%), focusing on their microstructure, mechanical properties, tribological behavior, and electrochemical corrosion resistance. The findings indicate a reduction in CMC coatings` porosity and mean free path (MFP) of reinforcement particles with increasing reinforcement content. Despite slight Co shell damage during deposition, ceramic retention is notably enhanced, reaching up to 149.3%. The microhardness and wear resistance of CMC coating are improved with decreased MFP and increased ceramic content. Compared to the Cu coating, the microhardness of CMC coatings escalates by up to 32.9% (151.8HV0.1), and the specific wear rate is dramatically reduced by up to 84.2%. The Co shell effectively prevents the detachment of Co@WC particles, thereby enhancing the bending and wear resistance. Electrochemical corrosion tests, encompassing open circuit potential (EOCP), polarization curve, and electrochemical impedance spectroscopy (EIS), indicate that lower porosity, high ceramic content and the Co shell substantially boost the corrosion resistance of the CMC coating. Specifically, the coating with 20 wt.% Co@WC (Cu20(Co@WC)) demonstrates superior corrosion resistance compared to the Cu coating, hinting at the potential for further enhancement with increased ceramic content.

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Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

Properties of Directly Electroplated Copper on CoMo Alloy Diffusion Barrier

Study of Direct Cu Electrodeposition on Ultra-Thin Mo for Copper Interconnect

Electrodeposition of Cu on CoTa Barrier in the Alkaline CuSO4-Ethylenediamine Solution

Study of A Single Layer Ultrathin Como Film As A Direct Plateable Adhesion/Barrier Layer for Next Generation Interconnect

Electrodeposition of nanocrystalline Ni-Mo alloys in pyrophosphate baths

Study on CMP of Copper Interconnect with Novel Mo-Based Diffusion Barriers

Barrier layer dependence of self-annealing effect in directly electroplated copper films

Electrodeposition of Nanostructured Co–Cu Thin Alloy Films on to Steel Substrate from an Environmentally Friendly Novel Lactate Bath under Different Operating Conditions

The Thermal and Electrical Properties of CoMo Alloys As Copper Adhesion/barrier Layers

Effect of Coxmoy As Single Barrier Layer on Properties of Directly Electroplated Copper Films

Electrodeposition of Ni–Co alloys from a deep eutectic solvent

Structure and Properties of Electrocodeposited Cu-Al2o3 Nanocomposite Thin Films

Cold-sprayed Cu Matrix Composite Coatings with Core-Shell Structured Co@WC Reinforcements on Q235 Steel

Influences of Co and process parameters on structure and corrosion properties of nanocrystalline Ni-W-Co ternary alloy film fabricated by electrodeposition at low current density

Electrodeposition of Mo Alloys and Their Electro-Catalysis Property

Effect of Corrosion Inhibitor and Non-ionic Surfactant on CMP of Cu/Co Barrier Stack

Electrodeposition and corrosion performance of Ni-Co alloys with different cobalt contents

Electrodeposition of Sm-Co Alloy Films with Nanocrystalline/Amorphous Structures from a Sulphamate Aqueous Solution