Abstract:In this work, an alkaline electrolyte containing copper sulfate and ethanediamine (En) as ligand was used for direct Cu electrodeposition on novel alloy barrier Co x Mo y films and comparison was made between alkaline bath and H 2 SO 4 -CuSO4 acidic bath. In alkaline bath, the nucleation density of Cu on Co 1 Mo 3 is much higher than that in acidic bath. It is found that the Cu island density increases and the surface roughness decreases with the higher content of Co in Co x Mo y films. Results show that adhesion between Cu and Co is better than that between Cu and Mo, which affects initial nucleation behavior and surface roughness of the deposited Cu films. Uniform and conformal copper was successfully electroplated on 5 nm Co1Mo3 layers covered patterned wafers in alkaline bath without additives.

Barrier layer dependence of self-annealing effect in directly electroplated copper films

Effect of Coxmoy As Single Barrier Layer on Properties of Directly Electroplated Copper Films

Properties of Directly Electroplated Copper on CoMo Alloy Diffusion Barrier

Direct copper plating on ultra-thin sputtered cobalt film in an alkaline bath

Direct copper electrodeposition on novel CoMo diffusion barrier

Interface Reliability and Diffusion Barrier Property of Co-W Barrier Layer with Modulated Structure

Feasibility Study on the Use of Cu(Co) Alloy for Barrierless Copper Metallization

Reliability Studies of Barrier Layers for Cu/PAE Low-K Interconnects.

Effects of Electrodeposited Co–W and Co–Fe–W Diffusion Barrier Layers on the Evolution of Sn/Cu Interface

Barrier layer and annealing temperature dependent microstructure evolution of nanocrystalline Cu films

Study of A Single Layer Ultrathin Como Film As A Direct Plateable Adhesion/Barrier Layer for Next Generation Interconnect

The Effect of Sputtered W-based Carbide Diffusion Barriers on the Thermal Stability and Void Formation in Copper Thin Films

The Thermal and Electrical Properties of CoMo Alloys As Copper Adhesion/barrier Layers

Influence of Field-Assisted Annealing on Cu(V) Barrier-Less Metallization

The Effect of Thermal Annealing of Mo Film on the CuInSe2 Layer Texture and Device Performance

Electrodeposition of Cu on CoTa Barrier in the Alkaline CuSO4-Ethylenediamine Solution

Evaluation of Cu(V) Self-Forming Barrier for Cu Metallization

Study on CMP of Copper Interconnect with Novel Mo-Based Diffusion Barriers

Application of Cu–C and Cu–V Alloys in Barrier-Less Copper Metallization

Thermal Performance of Sputtered Cu Films Containing Insoluble Zr and Cr for Advanced Barrierless Cu Metallization

The Effect of Co Content and Annealing Temperatures on the Resistivity in Ag-Co Films