Abstract:In this work, an alkaline electrolyte containing copper sulfate and ethanediamine (En) as ligand was used for direct Cu electrodeposition on novel alloy barrier Co x Mo y films and comparison was made between alkaline bath and H 2 SO 4 -CuSO4 acidic bath. In alkaline bath, the nucleation density of Cu on Co 1 Mo 3 is much higher than that in acidic bath. It is found that the Cu island density increases and the surface roughness decreases with the higher content of Co in Co x Mo y films. Results show that adhesion between Cu and Co is better than that between Cu and Mo, which affects initial nucleation behavior and surface roughness of the deposited Cu films. Uniform and conformal copper was successfully electroplated on 5 nm Co1Mo3 layers covered patterned wafers in alkaline bath without additives.

The Oxygen Barrier Properties of CoxMoy Diffusion Barrier for Cu Interconnect

Study on CMP of Copper Interconnect with Novel Mo-Based Diffusion Barriers

Effect of Coxmoy As Single Barrier Layer on Properties of Directly Electroplated Copper Films

Diffusion Barrier Performances of Direct Current Sputter-Deposited Mo and Moxn Films Between Cu and Si

In-situ temperature-dependent sheet resistance study of Cu films in oxygen ambient for heterogeneous integrations

Direct copper electrodeposition on novel CoMo diffusion barrier

Study of A Single Layer Ultrathin Como Film As A Direct Plateable Adhesion/Barrier Layer for Next Generation Interconnect

The Thermal and Electrical Properties of CoMo Alloys As Copper Adhesion/barrier Layers

Properties of Directly Electroplated Copper on CoMo Alloy Diffusion Barrier

Study of the sputtered Mo/TaN and Mo-Ta thin film as diffusion barrier for copper metallization

Studies of two-dimensional h-BN and MoS2 for potential diffusion barrier application in copper interconnect technology

Two-Dimensional h-BN and MoS2 as Diffusion Barriers for Ultra-Scaled Copper Interconnects

The Inhibition of Enhanced Cu Oxidation on Ruthenium∕Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru

Thermally stable Mo-Co-B thin film metallic glass as a potential diffusion barrier in Cu/Si contact system

Organosiloxane nanolayer as diffusion barrier for Cu metallization on Si

Reliability Studies of Barrier Layers for Cu/PAE Low-K Interconnects.

Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces

Electroless Plating Ni-based Barrier Layers for 3D Interconnection

Fabrication of Potential NiMoP Diffusion Barrier/seed Layers for Cu Interconnects Via Electroless Deposition

Barrier layer dependence of self-annealing effect in directly electroplated copper films

Investigation of Co/TaN Bilayer As Cu Diffusion Barrier