Abstract:In this work, an alkaline electrolyte containing copper sulfate and ethanediamine (En) as ligand was used for direct Cu electrodeposition on novel alloy barrier Co x Mo y films and comparison was made between alkaline bath and H 2 SO 4 -CuSO4 acidic bath. In alkaline bath, the nucleation density of Cu on Co 1 Mo 3 is much higher than that in acidic bath. It is found that the Cu island density increases and the surface roughness decreases with the higher content of Co in Co x Mo y films. Results show that adhesion between Cu and Co is better than that between Cu and Mo, which affects initial nucleation behavior and surface roughness of the deposited Cu films. Uniform and conformal copper was successfully electroplated on 5 nm Co1Mo3 layers covered patterned wafers in alkaline bath without additives.

Diffusion Barrier Performances of Direct Current Sputter-Deposited Mo and Moxn Films Between Cu and Si

Investigation in Feasibility of Molybdenum As A Back Contact Layer for Silicon Based Quantum Dot Solar Cells

Thermally stable Mo-Co-B thin film metallic glass as a potential diffusion barrier in Cu/Si contact system

Electroless Ni–Mo–P Diffusion Barriers with Pd-activated Self-Assembled Monolayer on SiO2

Study of the sputtered Mo/TaN and Mo-Ta thin film as diffusion barrier for copper metallization

Synthesis of Molybdenum Silicide by Both Ion Implantation and Ion Beam Assisted Deposition

The Effect of Thermal Annealing of Mo Film on the CuInSe2 Layer Texture and Device Performance

Thermal stability of Ta-Si-N/Zr barrier in Cu metallization

The Oxygen Barrier Properties of CoxMoy Diffusion Barrier for Cu Interconnect

Diffusing behavior of MoO3 on Al2O3 and SiO2 thin films

Interface study of molybdenum oxide thin films on n- and p-type crystalline silicon surface

Fabrication of Potential NiMoP Diffusion Barrier/seed Layers for Cu Interconnects Via Electroless Deposition

"Anomalous" diffusion in multi-layer silicide systems

Unleashing the Power of 2D MoS2: in Situ TEM Study of Its Potential As Diffusion Barriers in Ru Interconnects.

Direct copper electrodeposition on novel CoMo diffusion barrier

Physical properties of amorphous molybdenum silicide films for single-photon detectors

Properties of Directly Electroplated Copper on CoMo Alloy Diffusion Barrier

MoS 2 as an Effective Cu Diffusion Barrier with a Back-End Compatible Process

Unleashing the Power of 2D MoS 2 : In Situ TEM Study of Its Potential as Diffusion Barriers in Ru Interconnects

Atomic-scale investigation on diffusion mechanism of immiscible Mo/Cu system under different temperatures and electric field

Sputtered Ru–Ti, Ru–N and Ru–Ti–N Films As Cu Diffusion Barrier