Atomic-scale investigation on diffusion mechanism of immiscible Mo/Cu system under different temperatures and electric field

Yunqi Lu,Xiaolin Guo,Wenlong Zhao,Yumeng Wang,Jinlong Du,Chunliang Mao,Ming Li,Pengfei Wang,Lu Zhang,Jiaqian Tong
DOI: https://doi.org/10.1007/s10853-024-10257-8
IF: 4.5
2024-09-29
Journal of Materials Science
Abstract:Mo/Cu composites exhibit significant potential for applications in electronic packaging and other domains. However, the diffusion process and mechanism of Mo/Cu composites are difficult to experiment with. Therefore, in this paper, a new potential function is first constructed and verified for the Mo/Cu system. The Mo/Cu diffusion process is studied on the atomic scale by molecular dynamics (MD) simulation. The conditions for rapid diffusion of Mo/Cu are determined at 1000 K and Mo (100) interface orientation. The vacancy diffusion mechanism in the Mo/Cu system is elucidated through the analysis of the diffusion results. Finally, the diffusion under an external electric field is simulated, and the critical condition for diffusion is determined by increasing the vacancy concentration. The diffusion temperature can be reduced by about 100 K at E = 0.002 V/Å. This study can provide theoretical support for the electro-assisted preparation of Mo/Cu composites.
materials science, multidisciplinary
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