Abstract:Aluminum nitride (AlN) is one of the few electrically insulating materials with excellent thermal conductivity, but high-quality films typically require exceedingly hot deposition temperatures (>1000 °C). For thermal management applications in dense or high-power integrated circuits, it is important to deposit heat spreaders at low temperatures (<500 °C), without affecting the underlying electronics. Here, we demonstrate 100 nm to 1.7 μm thick AlN films achieved by low-temperature (<100 °C) sputtering, correlating their thermal properties with their grain size and interfacial quality, which we analyze by X-ray diffraction, transmission X-ray microscopy, as well as Raman and Auger spectroscopy. Controlling the deposition conditions through the partial pressure of reactive N2, we achieve an ∼3× variation in thermal conductivity (∼36-104 W m-1 K-1) of ∼600 nm films, with the upper range representing one of the highest values for such film thicknesses at room temperature, especially at deposition temperatures below 100 °C. Defect densities are also estimated from the thermal conductivity measurements, providing insight into the thermal engineering of AlN that can be optimized for application-specific heat spreading or thermal confinement.

Microstructure and thermal conductivity of aluminium nitride with (YCa)F3 as sintering aid

Microstructure and thermal conductivity of aluminium nitride with (CaY)F3 as the sintering aid

Transient Liquid-Phase Sintering And Thermal Conductivity Of Ain

Optimization of Microstructure to Improve Si3n4 Ceramics with Thermal Conductivity and Mechanical Properties: Effect of Si and Α-Si3n4 Powder Composition

Microstructure and thermal conductivity of AlN ceramics with ultra-fine Y2O3 powder addition

Effects of binary additives B2O3–Y2O3 on the microstructure and thermal conductivity of aluminum nitride ceramics

Thermal Conductivity of AlN Ceramics Sintered with CaF2 and YF3

Thermal Conductivity of AlN Ceramics with CaF2-YF3 Addition

Improving thermal conductivity of aluminum nitride ceramics by refining microstructure

Effects of Y2O3 and Yttrium Aluminates As Sintering Additives on the Thermal Conductivity of AlN Ceramic Substrates

Effect of Y2O3 on low temperature sintering and thermal conductivity of AlN ceramics

Effect of YF3 on densification behavior and thermal conductivity of AlN ceramics with Y2O3–YF3 additives under reducing atmosphere

Microstructure of low-temperature sintered AlN

Characterization of the Microstructure of Sintered Aln by Sem and Tem

Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques

Microstructure and Thermal Conductivity of Spark Plasma Sintering AlN Ceramics

The quantitative investigation of the lattice oxygen and grain edge oxygen on the thermal conductivity of aluminum nitride ceramics

High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature

Effects of AlN Content and Sintering Atmospheres on the Thermal Conductivity of Hot-Pressed SiC Ceramics

Low-Temperature Sintering of AlN Ceramics by Sm 2 O 3 -Y 2 O 3 -Cao Sintering Additives Formed Via Decomposition of Nitrate Solutions

New Insight on the Effect of Yttria-Based Secondary Phases on Sintering and Electrical Behavior of Aluminum Nitride Ceramics