Improving thermal conductivity of aluminum nitride ceramics by refining microstructure

Yaocheng Liu,Heping Zhou,Yin Wu,Liang Qiao
DOI: https://doi.org/10.1016/S0167-577X(99)00241-4
IF: 3
2000-01-01
Materials Letters
Abstract:A reheating process was developed to improve the thermal conductivity of low-temperature sintered aluminum nitride ceramics with Dy2O3, Li2O and CaO as additives. After the period of reheating, the amount of secondary phase was reduced to a very low level through carbothermal reduction. Microstructural investigation showed that the better the microstructure, the higher the thermal conductivity.
What problem does this paper attempt to address?