Effect Of Microstructural Modification On Thermal Conductivity And Strength Of Silicon Nitride

Liu Xingli,Ning Xiaoshan,Yosuke Takahashi
2015-01-01
Rare Metal Materials and Engineering
Abstract:With Y2O3 and MgO as sintering aids, various beta-Si3N4/alpha-Si3N4 ratios were adopted in starting powders to make a microstructural modification of silicon nitride ceramics. Dense samples were fabricated by Spark plasma sintering at 1600 degrees C and subsequent high-temperature heat treatment at 1900 degrees C. With the amounts of beta-Si3N4 increasing in the starting powders, the aspect ratio of the grains in the sintered samples decreases, leading to the decrease of strength and meanwhile affecting the amounts of grain boundary contents, which partly results in the increase of thermal conductivity of the samples.
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