Effect of molding methods and sintering schedule on the thermal conductivity of silicon nitride

W Xu,XS Ning,X Lu,KX Chen,HP Zhou
2003-01-01
Rare Metal Materials and Engineering
Abstract:Effect of sintering schedule and molding methods on the thermal conductivity of silicon nitride were studied in present paper. The Y2O3-MgO sintering additive system and two kinds of molding methods: dry pressing and CIP were adopted. The samples were first heated to the liquid-phase-forming temperature of 2 023 K and held for 0 h, 1 h and 2 h, respectively, and then rose to the sintering temperature of 2 173 K slowly. Results show that the relative density and thermal conductivity of dry pressing specimens increase, while the relative density of CIP specimens shows no relationship with the holding time at the liquid-phase-forming temperature. The thermal conductivity of CIP specimens also increase with the holding time, and the increment trends to slow-down. The thermal conductivity of 80.3 W/m(.)K were obtained using the CIP molding methods and 1 h holding time at the liquid-phase-forming temperature before sintering.
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