Abstract:Si3N4 ceramics with improved thermal conductivity and mechanical properties were prepared by carbothermal reduction and two‐step sintering. The addition of 2 wt% C led to the development of an intergranular phase YNSiO2 with reduced oxygen content. Notably, setting the pre‐sintering temperature at 1450°C promoted the formation of a rough bimodal morphology within the Si3N4 ceramics. Furthermore, an extended holding period at 1850°C resulted in additional grain growth and the elimination of intergranular phases. The Si3N4 specimens produced at 1450°C for 3 h followed by 1850°C for 8 h, incorporating 2 wt% C, exhibited a notable continuity between Si3N4 grains. The thickness of the grain boundary layer was only about 1 nm, and the N/O atomic ratio of the intergranular phase was measured to be 0.42. Consequently, the resulting thermal conductivity, flexural strength, and fracture toughness of Si3N4 specimens were found to be 101 W·m−1·K−1, 712 ± 29 MPa, and 7.7 ± 0.2 MPa·m1/2, respectively. Compared with samples without C additive and directly sintered at 1850°C for 8 h, the Si3N4 specimens produced in this work showed a significant increase of more than 50% in thermal conductivity and about 17% in fracture toughness.

Sintering of beta-Si3N4 Powder and Thermal Conductivity of the Ceramic

Sintering of β-Si_3N_4 Powder and Thermal Conductivity of the Ceramic

Optimization of Microstructure to Improve Si3n4 Ceramics with Thermal Conductivity and Mechanical Properties: Effect of Si and Α-Si3n4 Powder Composition

Study on Thermal Conductivity of Spark-Plasma-Sintered Silicon Nitride Ceramics

Effect of β-Si<sub>3</sub>N<sub>4</sub> Powder on Thermal Conductivity of Silicon Nitride Ceramics

Study on Thermal Conductivity of SPS-Sintered Si<sub>3</sub>N<sub>4</sub> Ceramics after Heat-Treatment

Study On Thermal Conductivity Of Sps-Sintered Si3n4 Ceramics After Heat-Treatment

Fabrication of Spherical Thermal-Conductive Silicon Nitride Powder

Effect of Post-Sintering Heat-Treatment on Thermal Conductivity of Si3N4 Ceramics Containing Different Additives

Effect Of Microstructural Modification On Thermal Conductivity And Strength Of Silicon Nitride

Study on Thermal Conductivity of Si3N4 Sintered with Y2O3-MgO Additive System

Influence of stabilizing ions and sintering process on the thermal conductivity of alpha-SiAlON ceramics

Fabrication of Si3N4 ceramics with improved thermal conductivity by carbothermal reduction and two‐step sintering

Study on the thermal conductivity of Si3N4 sintered with Y2O3-MgO additive system

Effect of CeO2, Dy2O3, Yb 2O3 and y2O3 additives on thermal conductivity of silicon nitride ceramics

Fabrication of Si 3 N 4 ceramics with high thermal conductivity and flexural strength via novel two-step gas-pressure sintering

Fabrication and thermal conductivity of AlN/BN ceramics by spark plasma sintering

Silicon Nitride Ceramics with High Thermal Conductivity and Excellent Mechanical Properties Fabricated with MgF2 Sintering Aid and Post Sintering Heat Treatment

Study Of The Comparative Effect Of Sintering Methods And Sintering Additives On The Microstructure And Performance Of Si3n4 Ceramic

Influence of α-Si3N4 coarse powder on densification, microstructure, mechanical properties, and thermal behavior of silicon nitride ceramics