Abstract:AlN is an ultra-wide bandgap semiconductor which has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is the key for stable device performance and allowing for long lifetimes. AlN, with its potentially high thermal conductivity, can play an important role serving as a dielectric layer, growth substrate, and heat spreader to improve device performance. However, the intrinsic high thermal conductivity of bulk AlN predicted by theoretical calculations has not been experimentally observed because of the difficulty in producing materials with low vacancy and impurity levels, and other associated defect complexes in AlN which can decrease the thermal conductivity. This work reports the growth of thick AlN layers by MOCVD with an air-pocketed AlN layer and the first experimental observation of intrinsic thermal conductivity from 130 K to 480 K that matches density-function-theory calculations for single crystal AlN, producing some of the highest values ever measured. Detailed material characterizations confirm the high quality of these AlN samples with one or two orders of magnitude lower impurity concentrations than seen in commercially available bulk AlN. Measurements of these commercially available bulk AlN substrates from 80 K to 480 K demonstrated a lower thermal conductivity, as expected. A theoretical thermal model is built to interpret the measured temperature dependent thermal conductivity. Our work demonstrates that it is possible to obtain theoretically high values of thermal conductivity in AlN and such films may impact the thermal management and reliability of future electronic and optoelectronics devices.

Research Progress of Alumina Nitride Ceramics with High Thermal Conductivity

New Progress of AlN Ceramic

Experimental Investigation of Aluminum Nitride Ceramics Based on Compliant Finishing Process

High-Thermal-Conductivity AlN Ceramics Prepared from Octyltrichlorosilane-Modified AlN Powder

The quantitative investigation of the lattice oxygen and grain edge oxygen on the thermal conductivity of aluminum nitride ceramics

Fabrication of High Thermal Conductivity Aluminum Nitride Ceramics via Digital Light Processing 3D Printing

Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

Microstructure and thermal conductivity of aluminium nitride with (CaY)F3 as the sintering aid

Improvement in mechanical properties in AlN-h-BN composites with high thermal conductivity

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Preparation of AlN microspheres/UHMWPE composites for insulating thermal conductors

AlN coatings with high thermal conductivity and excellent electrical properties for thermal management devices

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Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Numerical investigation of heat transfer in aluminum nitride ceramics with engineered microstructures

Phase composition, microstructure, electrical and thermal properties of TiN and Yb2O3-Sm2O3 doped AlN ceramics

Thermal conductivities and mechanical properties of AlN ceramics fabricated by three dimensional printing

Experimental Observation of High Intrinsic Thermal Conductivity of AlN

Hot-pressing sintered AlN-BN ceramics with high thermal conductivity and low dielectric loss

YAlO3 reinforced AlN composite ceramics with significantly improved mechanical properties and thermal shock resistance

Improving thermal conductivity of aluminum nitride ceramics by refining microstructure