New Progress of AlN Ceramic

Shanyi Du

2000-01-01

Journal of Functional Biomaterials

Abstract:Aluminum nitride has excellent thermal,electrical mechanical and chemical properties for use in electronic and structural applications,particularly as a substrate material.This article reviews in detail new progress of AlN in the fild of defects,thermal conduction mechanism,processing of powder and its hydrolysis and oxidation,and sintering at present.

What problem does this paper attempt to address?

Improvement of Electrical and Material Properties of Epoxy Resin/aluminum Nitride Nanocomposites for Packaging Materials

Chao Dai,Xiangrong Chen,Tie Jiang,Ashish Paramane,Yasuhiro Tanaka

DOI: https://doi.org/10.1016/j.polymertesting.2020.106502

IF: 5.1

2020-01-01

Polymer Testing

Abstract:This paper presents the influence of Aluminum Nitride (AlN) nanoparticles on the electrical and material properties of epoxy resin (EP). The EP/AlN nanocomposites with different concentrations of nano-AlN fillers are prepared. The dispersion of the nano-AlN particles in the composites is analyzed by a field emission scanning electron microscope (FESEM). The electrical properties are investigated by the space charge and DC conductivity measurements, whereas the material properties are studied by Fourier transform infrared (FT-IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC), respectively. The results show that the homo-charge accumulation appears near both electrodes during the polarization, but there are limited negative charges left near both electrodes in the depolarization for the pure EP sample. There is no space charge accumulation in the 1 wt% and 2 wt% EP/AlN nanocomposites. The electric field distortion of the pure EP sample is 20%. Moreover, the electric field distortion initially decreases with the increase of the nano-AlN content, but it increases for the 2 wt% nano-AlN sample. Temperature has a dominant influence on the DC conductivity of the EP/AlN nanocomposites comparing to the pure EP. However, the DC conductivity of the nanocomposites becomes stable at high temperatures. It is also found that the weight loss of the samples decreases with the addition of the nano-AlN and the 1 wt% nano-AlN sample has the highest glass transition temperature. It is elucidated that the high apparent mobility and activation energy facilitate the space charge transport and suppressing the space charge accumulation. Furthermore, the nano-AlN filler can increase the trap level and trap energy density of the deep traps in the sample. The dielectric loss of the EP at high frequency is reduced with the content of 1 wt% nano-AlN. Furthermore, the addition of the nano-AlN can improve the thermal stability of the EP. The 1 wt% nano-AlN sample has the superior electrical insulation and material performance amongst the tested materials.
Research Progress of Alumina Nitride Ceramics with High Thermal Conductivity

YAN Dong-ming,GAO Xiao-ju,LIU Guo-xi,CHANG Yong-wei,QIAO Guang-li,MOU Xiao-ming,ZHAO Bin

DOI: https://doi.org/10.16552/j.cnki.issn1001-1625.2011.03.030

2011-01-01

Abstract:Aluminum nitride(AlN) has been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials due to its remarkable properties,including high thermal conductivity,low thermal expansion coefficient,high electrical resistivity and good mechanic property.In this article,the basic characteristics of aluminum nitride ceramics were introduceed briefly.Its domestic and overseas research status and preparation process were emphatically summarized.The application example of aluminum nitride ceramics in several aspects were listed in the end.
Experimental Investigation of Aluminum Nitride Ceramics Based on Compliant Finishing Process

Fang Han,Wen-Hao Zhang,Wei Gao,Qi Sun,Bing-Feng Ju,Wu-Le Zhu

DOI: https://doi.org/10.1016/j.jmapro.2024.06.067

IF: 5.684

2024-01-01

Journal of Manufacturing Processes

Abstract:Aluminum Nitride (AlN), as a type of advanced functional ceramic material, has found wide applications in many fields, owing to its advantageous properties such as excellent thermal conductivity, high hardness and strength, etc. Nevertheless, these beneficial features bring great challenges to its machinability using current existing methods that commonly result in unsatisfactory surface qualities. In this paper, we investigated the processing performance of AlN by introducing the compliant bonnet finishing approach based on different tool bonding materials and abrasive sizes. The distinctive finishing qualities, material removal rates, tool wear behavior, etc., were studied and compared under various process conditions. Unlike other ceramics, resin bonded diamond tools with a 3 mu m abrasive size exhibit significant wear when used on AlN ceramics. The curves for tool wear amount and wear rate are investigated. Meanwhile, compliant tool with the smaller abrasive can obtain the sub-50 nm surface roughness. The comparison with traditional rigid pellet finishing further demonstrates the advantageous finishing performances by using compliant tools on the AlN ceramics.
Enhanced Thermal and Dielectric Performance of Epoxy Resin/aluminum Nitride Nanocomposites at High Temperatures

Xiangrong Chen,Chao Dai,Tie Jiang,Ashish Paramane

DOI: https://doi.org/10.1002/pc.25802

IF: 5.2

2020-01-01

Polymer Composites

Abstract:The effects of nano-aluminum nitride (nano-AlN) on the thermal conductivity and dielectric performances of epoxy resin (EP) are investigated. The addition of nanoparticles in the materials is characterized. The trap characteristics of the samples are estimated using the surface potential decay (SPD) measurements at high temperatures. The results show that the nano-AlN fillers are well dispersed in the nano-AlN composites. The thermal conductivity consistently increases with an increase of the nano-AlN content. The DC breakdown strength of the EP is enhanced with the addition of the nanoparticles as well, especially for the 0.5 and 1 wt% EP/AlN composites. The DC conductivity of the EP/AlN composites increases more obviously at the high temperature. The initial surface charge density of the samples with the same content of nano-filler decreases with the increase of the temperature. Both the addition of nanoparticles and high temperature can improve the apparent carrier mobility of the EP sample. The trap density and trap level of the deep traps decreases with the increase of the temperature. It is postulated that shallow traps influence the voltage decay in the EP samples and increase the activation energy and the apparent carrier mobility of the specimens at the high temperature.
Review on Deposition of C-Axis Oriented AlN Films by Reactive Magnetron Sputtering

ZHOU Jian,ZHAO Kai,FENG Bin,JIN Hao,WANG De-miao

DOI: https://doi.org/10.13385/j.cnki.vacuum.2011.06.012

IF: 4

2011-01-01

Vacuum

Abstract:Aluminum nitride film is a promising advanced ceramic material with a wide range of application in mechanics,optics and electronics.(002) oriented aluminum nitride film prepared by reactive magnetron sputtering has been successfully used in bulk acoustic wave and surface acoustic wave devices for GHz-band wireless communication systems.In this paper,two latest reactive sputtering models are briefly introduced and then the effects of the most critical deposition parameters on the growth and performance of aluminum nitride films are reviewed.
Fabrication of High Thermal Conductivity Aluminum Nitride Ceramics via Digital Light Processing 3D Printing

Tang,Xue,Zhou,Hu

DOI: https://doi.org/10.3390/ma17092010

IF: 3.4

2024-04-26

Materials

Abstract:The sintering of high-performance ceramics with complex shapes at low temperatures has a significant impact on the future application of ceramics. A joint process of digital light processing (DLP) 3D printing technology and a nitrogen-gas pressure-assisted sintering method were proposed to fabricate AlN ceramics in the present work. Printing parameters, including exposure energy and time, were optimized for the shaping of green bodies. The effects of sintering temperature, as well as nitrogen pressure, on the microstructure, density, and thermal conductivity of AlN ceramics were systematically discussed. A high thermal conductivity of 168 W·m−1·K−1 was achieved by sintering and holding at a significantly reduced temperature of 1720 °C with the assistance of a 0.6 MPa nitrogen-gas pressure. Further, a large-sized AlN ceramic plate and a heat sink with an internal mini-channel structure were designed and successfully fabricated by using the optimized printing and sintering parameters proposed in this study. The heat transfer performance of the ceramic heat sink was evaluated by infrared thermal imaging, showing excellent cooling abilities, which provides new opportunities for the development of ceramic heat dissipation modules with complex geometries and superior thermal management properties.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
High-performance aluminum nitride made by Vat photopolymerization through optimization of resin refractive index and plasticizer content

Junye Wang,Haidong Wu,Yujie Qi,Xiao Zong,Kunji Lin,Lifu Lin,Wenduo Zhang,Shanghua Wu

DOI: https://doi.org/10.1016/j.ceramint.2024.01.405

IF: 5.532

2024-01-01

Ceramics International

Abstract:In this study, we evaluated the effects of three resins with different refractive index on the viscosity and curing behavior of aluminum nitride (AlN) ceramic suspensions. Our findings indicate that the viscosity of the AlN suspensions increased with the concentration of polyethylene glycol o-phenylphenyl ether acrylate (OPPEA). Conversely, the viscosity decreased with increasing concentrations of cyclic trimethylolpropane formal acrylate (CTFA) and ethylene glycol phenyl ether acrylate (PHEA). Regarding the curing behavior, the AlN ceramic suspension prepared with OPPEA exhibited the largest cure depth and excess width, whereas the suspension prepared with CTFA had the lowest cure depth and excess width. Further analysis of the sensitivity and critical energy revealed that the suspension containing OPPEA demonstrated the highest sensitivity in the vertical direction and the lowest sensitivity in the horizontal direction. This implies that the smallest critical energy is in the vertical direction, and the largest critical energy is in the horizontal direction. Additionally, an increase in the content of the plasticizer dibutyl phthalate (DBP) was beneficial for reducing cracks in the AlN ceramic debinding bodies. Finally, high-performance AlN ceramics were produced, exhibiting a relative density exceeding 98 %, a bending strength of 470.39 ± 6.5 MPa, and a thermal conductivity of 163.45 W/m·K.

materials science, ceramics
The surface softening mechanism of AlN ceramic by laser treatment

Lingda Xiong,Chunjin Wang,Wei Wu,Linjiang Xu,Chunming Wang,Hui Deng,Chi Fai Cheung

DOI: https://doi.org/10.1016/j.surfin.2024.104023

IF: 6.2

2024-03-01

Surfaces and Interfaces

Abstract:Aluminum Nitride ceramic is an excellent material for heat dissipation in electronic applications. The precision machining of AlN ceramic is difficult due to its high hardness and brittleness. To improve the machinability of the ceramic material, a microsecond laser was applied to soften the surface of AlN ceramic in this work. To reveal the surface softening mechanism of the laser processing of AlN ceramic, the phase composition, microstructure, processing depth and hardness variation of laser-treated AlN ceramic surface were studied. The phase transition and surface morphology evolution during laser treatment were explained. It was found that Al and Al2O3 were formed on the surface after laser treatment. The surface hardness decreased from 14.3 GPa (base material) to 0.708 GPa. The revealed surface softening mechanism of laser treatment in this work is helpful for the optimization of the softening process and post-machining quality.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
High-Thermal-Conductivity AlN Ceramics Prepared from Octyltrichlorosilane-Modified AlN Powder

Guangqi Li,Bin Li,Bo Ren,Yang Li,Haiyang Chen,Junhong Chen

DOI: https://doi.org/10.3390/pr11041186

IF: 3.5

2023-04-13

Processes

Abstract:Aluminum nitride has been widely used as heat-management material for large-scale integrated circuits and semiconductor packages because of its excellent insulation, high thermal conductivity, low dielectric constant and loss, similar expansion coefficient to that of silicon, and non-toxicity. However, the increase of oxygen content caused by the hydration of aluminum nitride powder during storage often decreases the thermal conductivity of aluminum nitride ceramics. In this work, we propose an approach for preparing high-thermal-conductivity AlN ceramics via octyltrichlorosilane-modified AlN powder. The octyltrichlorosilane reacted with the hydroxyl group on the surface of the AlN powder forming a siloxane protective layer. The protective layer not only enhanced the water contact angle of AlN powder from 34.8° to 151°, but also ensured the phase of AlN powder did not change in the distilled water at 25 °C for 72 h. High-thermal-conductivity AlN ceramics up to 186 W·m−1·K−1 were successfully prepared based on the modified AlN powder which had been stored for one year. This work provides a simple, effective, and practical method for the stable preparation of high-thermal-conductivity AlN ceramics.

engineering, chemical
Additive manufacturing of complex-shaped and high-performance aluminum nitride-based components for thermal management

Lifu Lin,Haidong Wu,Peishen Ni,Yong Chen,Zhaoquan Huang,Yehua Li,Kunji Lin,Pengfei Sheng,Shanghua Wu

DOI: https://doi.org/10.1016/j.addma.2022.102671

IF: 11

2022-04-01

Additive Manufacturing

Abstract:Improved heat dissipation performance, by way of thermal management, is critical in many engineering applications. In this study, three types of silane coupling agents were used to modify aluminum nitride (AlN) powder for vat photopolymerization. The effect of silane coupling agents on the rheology, stability, and curing behavior were systematically studied. The results showed that, compared with two other types of silane coupling agents, one silane agent (KH570) had a larger positive effect on the rheology and stability of the AlN suspension, and the absorbance of the AlN powder increased after surface modification. In addition, the effects of different solid loadings on the curing behavior and CC double-bond conversion rate were systematically investigated. It was found that a higher solid loading resulted in a lower curing depth, cure width, and CC double-bond conversion rate. For the sintered AlN components with increased solid loading, the shrinkage decreased while both the flexural strength and thermal conductivity increased. In addition, the shrinkage in the Z-direction was higher than that in the X- and Y-directions. Scanning electron microscopy analysis showed that the mean grain size decreased with increasing solid loading. Furthermore, a heat dissipation performance evaluation system was designed to illustrate the heat transmission capacity of AlN ceramics. Simulation and experimental results showed that AIN ceramic parts with complex shapes achieved better heat-dissipation performance than those with simple shapes.

engineering, manufacturing,materials science, multidisciplinary
Effect of AlN on the Mechanical and Electrochemical Properties of Aluminum Metal Matrix Composites

Rokaya H Abdelatty,Ahmed Bahgat Radwan,Khaled Youssef,Muhammad Farzik Ijaz,Rana Abdul Shakoor

DOI: https://doi.org/10.3390/ma17133258

2024-07-02

Abstract:In the present investigation, aluminum metal matrix composites (AMMs) reinforced with aluminum nitride (AlN) nanoparticulates at different volumetric ratios of (0, 0.5, 1, 1.5, and 2 vol.%) were manufactured via a microwave-assisted powder metallurgy technique. The morphological, physical, mechanical, and electrochemical properties of the produced billets were examined to reflect the impact of the successive addition of AlN into the aluminum (Al) matrix. The morphological analysis revealed the high crystalline patterns of the formation of the Al-AlN composites. The microstructural analysis confirmed the presence of the elemental constituents of Al and AlN particles in the fabricated composites, showing an enhanced degree of agglomeration in conjunction with the additional amount of AlN. Positive behavior exhibited by the micro- and nanohardness was noticeable in the Al-AlN composites, especially at the ultimate concentration of AlN in the Al matrix of a 2 vol.%, where it reached 669.4 ± 28.1 MPa and 659.1 ± 11 MPa compared to the pure Al metal at 441.2 ± 20 MPa and 437.5 ± 11 MPa, respectively. A declining trend in the compressive strength was recorded in the reinforced Al samples. The corrosion resistance of the AlN-reinforced Al metal matrix was estimated at 3.5 wt.% NaCl using electrochemical impedance spectroscopy and potentiodynamic polarization. The results reveal that the inclusion of 2.0 vol.%AlN led to the lowest corrosion rate.
General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials

Bin Zhang,Zhengli Dou,Rui Yuan,Lu He,Zilong Xie,Chuanlong Li,Yongzheng Zhang,Qiang Fu,Kai Wu

DOI: https://doi.org/10.1021/acsami.4c14916

IF: 9.5

2024-10-31

ACS Applied Materials & Interfaces

Abstract:Aluminum nitride (AlN), noted for its excellent thermal conductivity and exceptional electrical insulation, presents a promising alternative to traditional ceramic particles in thermal interface materials (TIMs). However, its broader adoption in practical applications is limited by performance degradation due to the vulnerability of its crystal structure to ubiquitous moisture. This study introduces a dual solution, utilizing a mechanochemical method to design a dense outer layer of Galinstan...

materials science, multidisciplinary,nanoscience & nanotechnology
Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

Zhirui Zhang,Qing He,Haoyang Wu,Tao li,Yiming Zhang,Huifeng Lu,Chang Liu,Baorui Jia,Haiqing Yin,Aimin Chu,Zaiwen Zhu,Xuanhui Qu,Mingli Qin

DOI: https://doi.org/10.1016/j.ceramint.2023.07.230

IF: 5.532

2023-07-01

Ceramics International

Abstract:The heat dissipation requirements of the new generation of semiconductors are placing higher demands on the overall performance of aluminum nitride (AlN) ceramics. This has led to an increasing emphasis on AlN ceramics that combine thermal conductivity and strength. AlN ceramics are often strengthened by hot-press sintering, but their thermal conductivity is typically modest. In this study, pre-sintering and annealing processes are introduced to optimize the thermal conductivity of hot-pressed AlN ceramics to avoid the detrimental effects of oxygen impurities in the AlN lattice. The effect of the oxide layer on the surface of commercial AlN particles is investigated, including density, phase composition, microstructure, and fracture behavior. The effect of annealing on the improvement of thermal conductivity and flexural strength is also verified. Electron paramagnetic resonance (EPR) analysis is performed to examine the concentration of intercrystalline defects under various conditions. Finally, AlN ceramics with a thermal conductivity of 204 W m−1 K−1 and a flexural strength of 376 MPa are obtained.

materials science, ceramics
The Durability of Various Crucible Materials for Aluminum Nitride Crystal Growth by Sublimation

B. Liu,J.H. Edgar,Z. Gu,D. Zhuang,B. Raghothamachar,M. Dudley,A. Sarua,Martin Kuball,H. M. Meyer,H. M. Meyer III

DOI: https://doi.org/10.1557/s1092578300000417

2004-01-01

MRS Internet Journal of Nitride Semiconductor Research

Abstract:Producing high purity aluminum nitride crystals by the sublimation-recondensation technique is difficult due to the inherently reactive crystal growth environment, normally at temperature in excess of 2100 °C. The durability of the furnace fixture materials (crucibles, retorts, etc.) at such a high temperature remains a critical problem. In the present study, the suitability of several refractory materials for AlN crystal growth is investigated, including tantalum carbide, niobium carbide, tungsten, graphite, and hot-pressed boron nitride. The thermal and chemical properties and performance of these materials in inert gas, as well as under AlN crystal growth conditions are discussed. TaC and NbC are the most stable crucible materials with very low elemental vapor pressures in the crystal growth system. Compared with refractory material coated graphite crucibles, HPBN crucible is better for AlN self-seeded growth, as crystals tend to nucleate in thin colorless platelets with low dislocation density.
Comparison of aluminum nitride thin films prepared by magnetron sputter epitaxy in nitrogen and ammonia atmosphere

Balasubramanian Sundarapandian,Dat Q. Tran,Lutz Kirste,Patrik Straňák,Andreas Graff,Mario Prescher,Akash Nair,Mohit Raghuwanshi,Vanya Darakchieva,Plamen P. Paskov,Oliver Ambacher

DOI: https://doi.org/10.1063/5.0202161

IF: 4

2024-04-29

Applied Physics Letters

Abstract:Wurtzite-type aluminum nitride (AlN) thin films exhibiting high thermal conductivity, large grain size, and low surface roughness are desired for both bulk acoustic wave and surface acoustic wave resonators. In this work, we use ammonia (NH3) assisted reactive sputter deposition of AlN to significantly improve these properties. The study shows a systematic change in the structural, thermal, and morphological properties of AlN grown in nitrogen (N2) and N2 + NH3 atmosphere. The study demonstrates that NH3 assisted AlN sputtering facilitates 2D growth. In addition, the study presents a growth model relating the 2D growth to improve the mobility of aluminum (Al) and nitrogen (N) ad-atoms in NH3 atmosphere. Consequently, the thermal conductivity and roughness improve by ≈76%, and ≈35%, while the grain size increases by ≈78%.

physics, applied
YAlO3 reinforced AlN composite ceramics with significantly improved mechanical properties and thermal shock resistance

Guohua Shi,Xiaohong Sun,Ning Dai,Zhongyan Wang,Nan Liu,Zhongkai Xu,Zhe Chen,Shu Cai,Xuming Lv,Chunming Zheng,Jian Zhang,Yao Han,Bingqing Zhang

DOI: https://doi.org/10.1016/j.ceramint.2023.02.152

IF: 5.532

2023-06-01

Ceramics International

Abstract:AlN is regarded as a promising ceramic material for high performance structural and high temperature applications due to its superior properties such as high thermal conductivity, excellent stability and wear resistance. However, challenges remain in fabricating AlN ceramics with high strength and high thermal shock resistance. In this work, AlN/YAlO3 composites with different YAlO3 contents (3–10 wt%) were prepared by a simple pressureless sintering method, and the impact of YAlO3 content on mechanical properties and thermal shock resistance of AlN/YAlO3 composites was investigated. Results show that the grain growth of AlN is inhibited and the densification is improved with the addition of 3 wt% and 5 wt% YAlO3. Hence, the flexural strength and fracture toughness of AlN/YAlO3 composites are improved due to the grain refinement and compactness enhancement, and the highest value, 369 MPa and 3.84 MPa m1/2, are reached by the AlN-5 wt% YAlO3 composite. Moreover, the thermal shock resistance was assessed through theoretical forecast and cyclic thermal shock tests over a temperature range between 1000 °C and 1600 °C. Comparing with pure AlN, the thermal stress damage resistance parameters (R IV ) of AlN/YAlO3 composites were increased, while their residual strengths and retention ratios after 10–50 cycles of thermal shock tests maintained a higher level as well. Microstructure analysis revealed that the thermal shock resistance of AlN/YAlO3 composites was evidently improved attributing to various strengthening mechanisms such as crack deflection, crack branching and microcrack toughening.

materials science, ceramics
New Insight on the Effect of Yttria-Based Secondary Phases on Sintering and Electrical Behavior of Aluminum Nitride Ceramics

M. Coëffe-Desvaux,T. Tabares-Medina,N. Pradeilles,P. Marchet,M. Joinet,A. Maitre

DOI: https://doi.org/10.1007/s11665-022-06588-9

IF: 2.3

2022-02-03

Journal of Materials Engineering and Performance

Abstract:Full dense aluminum nitride ceramics (AlN) were prepared by hot-pressing sintering with and without yttrium oxide (Y2O3) as sintering aid. An intensive analysis of the AlN raw powder was performed to identify impurities. AlN grains appeared to be coated of an amorphous layer mainly composed of boehmite-like bonds. Thanks to the sintering process used all samples obtained exhibit high densification rate. The crystalized secondary phases identified by x-ray diffraction belong to the pseudo-binary Al2O3 – Y2O3. During sintering, AlN’s native oxide phase, observed on grains surface, plays a key role on formation of yttrium-based secondary phases such as YAM (Y4Al2O9), YAP (YAlO3) and YAG (Y3Al5O12). The formation of secondary phases was investigated thanks to quenching tests at different temperatures from 1400 to 1600 °C. Influence of secondary phases on DC electrical behavior was determined using current leakage measurement. The electrical properties appeared to be more impacted by the presence of these phases than by the densification improvement caused by yttria addition.

materials science, multidisciplinary
Preparation of Aln Films by Pulsed Laser Deposition Using Sintered Aluminum Nitride and Elemental Aluminum As Raw Materials

JD Wu,J Sun,ZF Ying,W Shi,H Ling,FM Li,ZY Zhou,KL Wang,XM Ding

DOI: https://doi.org/10.1116/1.1329119

2001-01-01

Abstract:Aluminum nitride films have been prepared on Si (100) substrates through two methods: basic pulsed laser deposition from sintered aluminum nitride ceramics and plasma-aided reactive pulsed laser deposition from elemental aluminum metal. The latter was performed in a nitrogen plasma environment generated from electron cyclotron resonance microwave discharge. The films deposited by both methods have been characterized by various techniques to examine the morphology and to determine the composition and structure. The formation of aluminum nitride compound was confirmed in the deposited films. The films prepared by basic pulsed laser deposition are found to contain oxygen impurities, while those obtained through the plasma aided method have exhibited a stoichiometric AlN composition. The films have shown better crystalline quality when prepared at higher temperatures, however, when aided by the nitrogen plasma the films contain pure AlN compound with much better crystalline quality even prepared at low temperatures. Mechanisms relevant to the deposition processes are also discussed with particular emphasis on the contributions of the nitrogen plasma to the film formation. A comparison of the different characteristic features associated with the films prepared by the two methods shows that the plasma aided method has reasonable advantages in preparing compound films.
Optimization Of Non-Aqueous Tape Casting Of High Solid Loading Slurry For Aluminum Nitride Ceramic Substrates

Maomao Ding,Ying Shi,Jianjun Xie,Ding Zhou,Yu Wang,Fang Lei,Lei Zhang

DOI: https://doi.org/10.1111/ijac.13344

2020-01-01

International Journal of Applied Ceramic Technology

Abstract:Aluminum nitride (AlN) ceramic substrates have been fabricated using non-aqueous tape casting and pressureless densification under flowing N-2 atmosphere. Considering the economic and environmental impact, a new strategy of solvent and dispersant system was adopted to prepare AlN slurries with high solid loading. According to the viscosity characteristics of AlN slurries, dispersant content was adjusted to be 0.5 wt% of AlN powder in order to optimize the rheological behavior of AlN slurries. The addition contents of binder and plasticizer were both optimized as 5 wt% of AlN powders by combining the viscosity of slurries and tensile strength of green tapes. Green AlN tapes were fabricated with an optimized tape casting process such as dry temperature. The exclusion process of organic additives was investigated by employing thermogravimetric analysis. Flat and dense AlN ceramic substrates with a relative bulk density over 99.75 % were achieved after being sintered under 1800 degrees C for 6 hours, which had a maximum size of 110 x 110 mm. The thermal conductivity of the AlN substrate could reach 145 Wm(-1)K(-1).

New Progress of AlN Ceramic

Improvement of Electrical and Material Properties of Epoxy Resin/aluminum Nitride Nanocomposites for Packaging Materials

Research Progress of Alumina Nitride Ceramics with High Thermal Conductivity

Experimental Investigation of Aluminum Nitride Ceramics Based on Compliant Finishing Process

Enhanced Thermal and Dielectric Performance of Epoxy Resin/aluminum Nitride Nanocomposites at High Temperatures

Review on Deposition of C-Axis Oriented AlN Films by Reactive Magnetron Sputtering

Fabrication of High Thermal Conductivity Aluminum Nitride Ceramics via Digital Light Processing 3D Printing

High-performance aluminum nitride made by Vat photopolymerization through optimization of resin refractive index and plasticizer content

The surface softening mechanism of AlN ceramic by laser treatment

High-Thermal-Conductivity AlN Ceramics Prepared from Octyltrichlorosilane-Modified AlN Powder

Additive manufacturing of complex-shaped and high-performance aluminum nitride-based components for thermal management

Effect of AlN on the Mechanical and Electrochemical Properties of Aluminum Metal Matrix Composites

General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials

Balancing thermal conductivity and strength of hot-pressed AlN ceramics via pre-sintering and annealing process

The Durability of Various Crucible Materials for Aluminum Nitride Crystal Growth by Sublimation

Comparison of aluminum nitride thin films prepared by magnetron sputter epitaxy in nitrogen and ammonia atmosphere

YAlO3 reinforced AlN composite ceramics with significantly improved mechanical properties and thermal shock resistance

New Insight on the Effect of Yttria-Based Secondary Phases on Sintering and Electrical Behavior of Aluminum Nitride Ceramics

Preparation of Aln Films by Pulsed Laser Deposition Using Sintered Aluminum Nitride and Elemental Aluminum As Raw Materials

Optimization Of Non-Aqueous Tape Casting Of High Solid Loading Slurry For Aluminum Nitride Ceramic Substrates