Thermal conductivities and mechanical properties of AlN ceramics fabricated by three dimensional printing

Wenyan Duan,Shan Li,Gong Wang,Rui Dou,Li Wang,Yubei Zhang,Haiqing Li,Huihui Tan
DOI: https://doi.org/10.1016/j.jeurceramsoc.2020.04.004
IF: 5.7
2020-08-01
Journal of the European Ceramic Society
Abstract:<p>AlN ceramics were successfully fabricated through a joint process of digital light processing (DLP) 3D printing technology and heat treatment at 1780 °C∼1845 °C. DLP is an addictive manufacturing process, enabling the near net shape fabrication. The AlN grains in this work developed well and there were small amounts of grain-boundary phases at the three-grain junctions. The particle size of AlN became larger and the densification increased with increasing sintering temperature. The pores of AlN ceramics also decreased, which led to the increase of thermal conductivity and flexural strength. The optimal thermal conductivity and flexural strength of AlN ceramic reached 155 W/(m·K) and 265 ± 20 MPa when sintered at 1845 °C.</p>
materials science, ceramics
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