Abstract:Semiconductor products are indispensable for 5th Generation (5G) communication (next-generation standard), automated driving technology enabled by artificial intelligence (AI), and large capacity storage for data centers. A variety of heaters are used in the semiconductor manufacturing process to heat semiconductor wafers. Notably, wafers must be heated in many steps in the frontend process, including the application of a photoresist film on wafers, chemical vapor deposition (CVD) to deposit various types of films on wafers, and dry/wet etching to etch the wafer surface. It supports different temperature ranges (room temperature to 1,000°C), using various heaters. Recently, there has been a growing need to increase the processing speed of multi-core central processing units (CPUs) and GPUs*1 for AI and to increase the storage capacity of data centers. Against this backdrop, there has been growing demand for miniaturization of the circuit wiring to increase the integration degree of processing units. This requires formation of a homogeneous film. It is also essential to achieve uniform temperature distribution on the wafer surface. SumiTune, which is introduced in this paper, achieves highly uniform temperature distribution on the wafer surface by means of multi-zone control, which was difficult to achieve in the conventional single-wafer film deposition equipment. This is a next-generation system that can meet the demand for miniaturization of the circuit wiring.

Wafer heating apparatus

Wafer heating device and the wafer heating method

Of the semiconductor wafer temperature control device and the control method

Wafer temperature control method and equipment

Analysis of the Effect of Heating Control Conditions on Temperature Distribution in a Wafer During Rapid Thermal Processing With Lamp Heaters

Thermal design aspects for improving temperature homogeneity of silicon wafer during thermal processing in microlithography

Study and fabrication of a heater-strip embedded type micro-hotplate

An efficient plate heater with uniform surface temperature engineered with effective thermal materials

Silicon based micro heating plate provided with embedded heating wire, and processing method thereof

Study on Characterization of Micro Heater Used for Micro PCR Chip

Experiment and Thermal Calculation of Micro Heater

Development of a Reliable Micro-Hotplate with Low Power Consumption

Development of a Microheater with a Large Heating Area and Low Thermal Stress in the Heating Area

Design of a Hot Plate with Rapid Cooling Capability for Thermal Nanoimprint Lithography

Fabrication of Planar Heating Chuck Using Nichrome Thin Film as Heating Element for PECVD Equipment

“SumiTune” High-Precision Temperature Distribution Control System for Single-Wafer Film Deposition Equipment

Effect of Substrate Heating in Thickness Correction of Quartz Crystal Wafer by Plasma Chemical Vaporization Machining

Thermal design for enhanced temperature uniformity on spark plasma sintering device

Development of a High Throughput Micro-Heater Array with Controllable Temperature for Each Heating Unit

Simulation of temperature profile and design of heat transfer structure for reactor of film growth on Si-wafer

Temperature distribution in semiconductor wafers heated in a vertical diffusion furnace