Development of a Microheater with a Large Heating Area and Low Thermal Stress in the Heating Area

Tao Zhang,Zequan Pan,Chunhua Zhang,Liuguang Xiong,Chunmei Yang,Jian Zhang,Mengjiao Shi,Yuhang Wang,Wen Qu

DOI: https://doi.org/10.3390/mi15010130

IF: 3.4

2024-01-13

Micromachines

Abstract:In this paper, a microheater that can absorb thermal stress and has a large heating area is demonstrated by optimizing the structure and process of the microheater. Four symmetrically distributed elongated support beam structures were machined around the microheater via deep silicon etching. This design efficiently mitigates the deformation of the heated region caused by thermal expansion and enhances the structural stability of the microheater. The updated microheater no longer converts the work area into a thin film; instead, it creates a stable heating platform that can uniformly heat a work area measuring 10 × 10 mm2. The microheater is verified to have high temperature uniformity and structural stability in finite element simulation. Finally, thorough investigations of electrical–thermal–structural characterization were conducted. The test findings show that the new microheater can achieve 350 °C with a power consumption of 6 W and a thermal reaction time of 22 s. A scan of its whole plane reveals that the surface of the working area of the new microheater is flat and does not distort in response to variations in temperature, offering good structural stability.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied

What problem does this paper attempt to address?

### Problems the Paper Attempts to Solve

This paper aims to design a MEMS microheater with a novel support beam structure to address the issues of deformation or breakage of traditional thin-film microheaters at high temperatures, and to improve their mechanical stability and heating area.

Specifically:
1. **Mechanical Stability**: By optimizing the structure and process of the microheater, four symmetrically distributed long support beams were designed to reduce deformation caused by thermal expansion in the heating area, enhancing the structural stability of the microheater.
2. **Heating Area**: The new microheater no longer processes the working area into a thin film but creates a stable heating platform capable of uniformly heating a 10 × 10 mm² working area.
3. **Temperature Uniformity**: A platinum thin-film spiral design is used to cover the entire heating area, ensuring temperature uniformity.
4. **Reduced Power Consumption**: The newly designed suspended support structure reduces the power consumption of the microheater.

Ultimately, experimental results show that this new type of microheater can reach 350°C at 6 watts of power and complete the thermal response time within 22 seconds, with a flat surface and no deformation, demonstrating good structural stability.