High quality Ge-rich SiGe thin films epitaxially grown on Si at low temperature by two-step approach

ke tao,Jin Wang,shuai jiang,rui jia,Zhi Jin,Xin-yu Liu
DOI: https://doi.org/10.1039/C9CE00948E
IF: 3.756
2019-01-01
CrystEngComm
Abstract:In this paper, a two-step growth approach was proposed to deposit a Ge-rich Si1-xGex epilayer directly on a Si substrate by reactive thermal CVD (RTCVD) at low temperature (350 degrees C). The two-step growth process included seed layer epitaxial growth, post-annealing, and a second epitaxial growth step. The effect of the two-step growth approach on the crystalline quality of the Si1-xGex epilayer was investigated. Raman and TEM measurements indicate that a perfect Si1-xGex film structure, with few in-film defects, can be achieved by the two-step approach, and the resulting Si1-xGex films exhibited an RMS roughness of 1.02 nm with a threading dislocation density of similar to 4.5 x 10(5)/cm(2) and a degree of strain relaxation of up to 100%. These results suggest that two-step growth, combined with annealing, is a good approach to fabricate a high-quality Si1-xGex epilayer by RTCVD at low temperature.
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