Single-Crystalline Si1-Xgex (X=0.5 Similar To 1) Thin Films On Si (001) With Low Threading Dislocation Density Prepared By Low Temperature Molecular Beam Epitaxy

Yu Gu,Yunlei Zhao,Jiajia Ye,Yu Deng,Hong Lu
DOI: https://doi.org/10.3390/app9091772
2019-01-01
Abstract:Single-crystalline Si1-xGex thin films on Si (100) with low threading dislocation density (TDD) are highly desired for semiconductor industrials. It is challenging to suppress the TDD since there is a large mismatch (4.2%) between Ge and Siit typically needs 10(6)-10(7)/cm(2) TDD for strain relaxation, which could, however, cause device leakage under high voltage. Here, we grew Si1-xGex (x = 0.5-1) films on Si (001) by low temperature molecular beam epitaxy (LT-MBE) at 200 degrees C, which is much lower than the typical temperature of 450-600 degrees C. Encouragingly, the Si1-xGex thin films grown by LT-MBE have shown a dramatically reduced TDD down to the 10(3)-10(4)/cm(2) level. Using transmission electron microscopy (TEM) with atomic resolution, we discovered a non-typical strain relaxation mechanism for epitaxial films grown by LT-MBE. There are multiple-layered structures being introduced along out-of-plane-direction during film growth, effectively relaxing the large strain through local shearing and subsequently leading to an order of magnitude lower TDD. We presented a model for the non-typical strain relaxation mechanism for Si1-xGex films grown on Si (001) by LT-MBE.
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