Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof

Xin Sun,Qinghu Cui,Yunhui Zhu,Zhiyuan Zhu,Min Miao,Jing Chen,Yufeng Jin
DOI: https://doi.org/10.1109/icept.2011.6066794
2011-01-01
Abstract:In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.
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