Abstract:Due to the slow scaling of board and package technology, on-chip inductor has shown promising potential to enable more compact design and smaller parasitics for inductor-based designs, such as voltage regulator, resonant clocking, filter, etc. On the other hand, conventional on-chip 2D spiral inductor must be placed on the top metal layers, thereby consuming significant routing resources for global interconnects. Moreover, it may need more dedicated shielding to prevent unnecessary coupling, which further increases its occupied area. With the popularity of 2.5D and 3D chip architecture, Through-Silicon-Via (TSV) has been widely used, a significant portion of which are placed for thermal/manufacturability/reliability purposes. Thus, those redundant TSVs can be utilized to form the on-chip inductor for 2.5D/3D chips, with lower footprint and higher inductance density compared from the conventional spiral inductor. Unlike prior works focusing on the inductor itself, this paper discusses the optimization and application of such TSV-inductor from system perspective, including the optimization options and its design considerations. The possible design options including physical parameters, architecture and materials, to optimize the TSV-inductor are thoroughly investigated. Based on that, we further study a few key design scenarios to evaluate the design impact with use of such TSV-inductor and provide the design guidelines for its application in actual system designs.

Modeling of TSV-based Solenoid Inductors for 3-D Integration

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias

TSV inductor optimization and its design implication

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

Modeling of TSV-Based 3-D Heterogeneous Solenoid Inductor with High Inductance Value

Modeling of a Pair of Annular Through Silicon Vias (TSV)

On the Efficacy of Through-Silicon-Via Inductors

Modeling of Solenoid-Actuated Valve System

Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Physics Based Scalable Inductance Model for Three-Dimensional Solenoid Inductors

System-level Design Consideration and Optimization of Through-Silicon-via Inductor.

A Fast Analytical Model for TSV-based Toroidal Inductors

Broadband Lumped-Element Parameter Extraction Method of Two-Port 3D MEMS In-Chip Solenoid Inductors Based on a Physics-Based Equivalent Circuit Model

Simulation and Optimization of High Performance On-Chip Solenoid MEMS Inductor

Accurate Inductance Modeling of 3-D Inductor Based on TSV

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

Modeling annular through-silicon Via pairs in 3-D integration

HR-Si TSV Integrated Inductor

Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer