Realization of A Series Contact Mems Switch with Sion Dielectric Bridge

Hu Guangwei,Liu Zewen,Hou Zhihao,Li Zhijian,Liu Litian
IF: 1.019
2008-01-01
Chinese Journal of Electronics
Abstract:A new series contact MEMS switch is proposed and realized using silicon oxynitride (SiON) as bridge film, which allows the switch to work at lower voltage, insulate the via voltage from the signal path, and avoid the possible crosstalk. The SiON bridge with low tensile stress of 76.8MPa is prepared with Plasma enhanced chemical vapor deposition (PECVD) at the gas flux ratio of 32:12:8 sccm (SiH4: NH3: N2O). The contact metallic bar and upper electrodes are all located on the rear side of the bridge, which enhances the switch mechanical reliability a lot. The measured results show the pull-in voltage of 23.3V, insertion loss less than 0.31dB and isolation higher than 40.0dB at DC-5GHz. The lifetime of more than 5 x 10(6) cycles has been observed under 0.1W RF power.
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