Abstract:In this article, the degradation behavior of the electrical characteristics of AlGaN/GaN HEMTs subjected to radio frequency (RF) overdrive stress has been studied. Trap analysis based on low-frequency noise (LFN) and electroluminescence (EL) characterizations was carried out for AlGaN/GaN HEMTs before and after RF stress. The experimental results show that drain-to-source current of AlGaN/GaN HEMTs after RF stress is obviously lower than that of the fresh devices. The maximum change of drain-to-source current was up to 79 mA in the saturation zone. The threshold voltage drifted forward and gate-lag characteristic became worse for the AlGaN/GaN HEMTs after RF stress. The EL characterizations also showed the nonuniformity of channel illumination intensity, which indicates the distribution of electron of the channel nonuniform. Trap analysis was performed by using the LFN method, and the LFN results showed that the trap density increased by about one order of magnitude in the AlGaN/GaN HEMTs after RF stress, which would lead to more depletion of the channel two-dimensional electron gas (2DEG) electrons. The mechanism of increasing trap density could be attributed to defects induced by RF stress at AlGaN surface and AlGaN barrier layer. The experimental results may offer a useful reference in the design and application of RF of AlGaN/GaN HEMTs.

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