Multiple Defects Cause Degradation After High Field Stress in AlGaN/GaN HEMTs

Rong Jiang,Xiao Shen,Jingtian Fang,Pan Wang,En Xia Zhang,Jin Chen,Daniel M. Fleetwood,Ronald D. Schrimpf,Stephen W. Kaun,Erin C. H. Kyle,James S. Speck,Sokrates T. Pantelides
DOI: https://doi.org/10.1109/TDMR.2018.2847338
IF: 1.886
2018-01-01
IEEE Transactions on Device and Materials Reliability
Abstract:Gate and drain bias dependences of hot carrier degradation are evaluated for AlGaN/GaN HEMTs fabricated via two different process methods. Both positive and negative threshold voltage Vth shifts are observed for each device type, depending on the mode and duration of the stress, indicating the presence of significant densities of donor-like and acceptor-like traps. Worst-case stress bias for trans...
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