Abstract:TSVs can be fabricated with pitch of only tens of μm, and smaller. They can be densely distributed as inter-die interconnect in 3D ICs. However, the huge mismatch between the probe technology, such as the pitch of probe head and the capacity of probe card, and the TSV fabrication technology leads to an insufficient probe on TSV tips. In this paper, we present a novel TSV probing technique that can temporally bond pre-bond die to test interposer using anisotropic conductive adhesive material. On the two sides of the test interposer, TSVs and probe heads make contact with microbumps and C4-bumps, respectively. These two types of bumps are connected using redistribution metal layers, passing through the test interposer, which can bridge the gap between feature sizes of TSVs and probe head. This probing technology is also able to increase the test bandwidth by enlarging the test interposer and redistributing test signals between microbumps and C4-bumps. Moreover, the number of probe-card touchdown can be reduced by sharing the test interposer among multiple dies during the wafer-level testing. Simulation results on the corresponding test structures for TSVs open fault and leakage fault show the great test resolution and robustness considering different design choices and variable design parameters among the test structures.

TSV Prebond Test Method Based on Switched Capacitors.

TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test.

Post-bond Test for TSVs Using Voltage Division.

Pre-Bond Tsv Testing Method Using Constant Current Source

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method

Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs

A Compressive-sensing based Testing Vehicle for 3D TSV Pre-bond and Post-bond Testing Data.

A Post-Bond TSV Test Method Based on RGC Parameters Measurement

The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source

A Prebond TSV Test Scheme Using Oscillator

A Systematic Test Approach for Through-Silicon Via (tsv) Process

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

A Post-Bond TSVs Test Solution for Leakage Fault.

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

An In-line Test Method for the TSV Insulation Integrity

Fault Detection and Redundancy Design for TSVs in 3D ICs.

A Novel Tsv Probing Technique with Adhesive Test Interposer

Study on TSV Insulating Medium Based on SACVD Process

TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement.

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs