Abstract:3-D-stacked integrated circuits (ICs) that employ through-silicon vias (TSVs) to connect multiple dies vertically have gained wide-spread interest in the semiconductor industry. In order to be commercially viable, the assembly yield for 3-D-stacked ICs must be as high as possible, requiring TSVs to be reparable. Existing techniques typically assume TSV faults to be uniformly distributed and use neighboring TSVs to repair faulty ones, if any. In practice, however, clustered TSV faults are quite common due to the fact that the TSV bonding quality depends on surface roughness and cleanness of silicon dies, rendering prior TSV redundancy solutions less effective. Furthermore, existing techniques consume a lot of redundant TSVs that are still costly in the current TSV process. This inefficient TSV redundancy can limit the amount of TSVs that is allowed to use and may even become the obstacle to commercial production. To resolve this problem, we present a novel TSV repair framework, including a hardware redundancy architecture that enables faulty TSVs to be repaired by redundant TSVs that are farther apart, the corresponding repair algorithm and the redundancy architecture construction. By doing so, the manufacturing yield for 3-D-stacked ICs can be dramatically improved, as demonstrated in our experimental results.

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test.

A Compressive-sensing based Testing Vehicle for 3D TSV Pre-bond and Post-bond Testing Data.

Fault Detection and Redundancy Design for TSVs in 3D ICs.

A Systematic Test Approach for Through-Silicon Via (tsv) Process

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs

Testing 3D chips containing through-silicon vias

TSV Prebond Test Method Based on Switched Capacitors.

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Survey on Testing Methods for 3D IC

Pre-Bond Tsv Testing Method Using Constant Current Source

A 3D Integration Testing Vehicle with TSV Interconnects

The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source

On Effective Through-Silicon Via Repair for 3-D-stacked ICs

On Effective Tsv Repair For 3d-Stacked Ics