Abstract:3-D-stacked integrated circuits (ICs) that employ through-silicon vias (TSVs) to connect multiple dies vertically have gained wide-spread interest in the semiconductor industry. In order to be commercially viable, the assembly yield for 3-D-stacked ICs must be as high as possible, requiring TSVs to be reparable. Existing techniques typically assume TSV faults to be uniformly distributed and use neighboring TSVs to repair faulty ones, if any. In practice, however, clustered TSV faults are quite common due to the fact that the TSV bonding quality depends on surface roughness and cleanness of silicon dies, rendering prior TSV redundancy solutions less effective. Furthermore, existing techniques consume a lot of redundant TSVs that are still costly in the current TSV process. This inefficient TSV redundancy can limit the amount of TSVs that is allowed to use and may even become the obstacle to commercial production. To resolve this problem, we present a novel TSV repair framework, including a hardware redundancy architecture that enables faulty TSVs to be repaired by redundant TSVs that are farther apart, the corresponding repair algorithm and the redundancy architecture construction. By doing so, the manufacturing yield for 3-D-stacked ICs can be dramatically improved, as demonstrated in our experimental results.

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test.

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

Fault Detection and Redundancy Design for TSVs in 3D ICs.

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

On Effective Tsv Repair For 3d-Stacked Ics

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Scheduling Tests for 3D Stacked Chips under Power Constraints

System-Level Analysis of 3D ICs with Thermal TSVs

Testing 3D chips containing through-silicon vias

TSV Prebond Test Method Based on Switched Capacitors.

On Effective Through-Silicon Via Repair for 3-D-stacked ICs

The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

A Scan-Chain-Based Built-in Self-Test for ILV in Monolithic 3-D ICs

Survey on Testing Methods for 3D IC

A Cost-Effective Pre-Bond Functional Test Architecture for 3d Socs

Integrated Test-Architecture Optimization and Thermal-Aware Test Scheduling for 3-D SoCs under Pre-Bond Test-Pin-Count Constraint