Abstract:In order to solve the problem of high cost of chip testing in the process of Three-Dimensional (3D) chip manufacturing,a new scheduling method based on Time Division Multiplexing (TDM) was proposed to optimize the testing resources between layers,layer and core cooperatively.Firstly,the shift registers were arranged on each layer of 3D chip,and the testing frequency was divided properly between the layers and cores of the same layer under the control of shift register group on input data,so that the cores in different locations could be tested in parallel.Secondly,greedy algorithm was used to optimize the allocation of registers for reducing the free test cycles of core parallel test.Finally,Discrete Binary Particle Swarm Optimization (DBPSO) algorithm was used to find out the best 3D stack layout,so that the transmission potential of the Through Silicon Via (TSV) could be adequately used to improve the parallel testing efficiency and reduce the testing time.The experimental results show that,under the power constraints,the utilization rate of the optimized whole Test Access Mechanism (TAM) is increased by an average of 16.28％,and the testing time of the optimized 3D stack is reduced by an average of 13.98％.The proposed method can decrease the time and reduce the cost of testing.

Session-Less Test Scheduling for Multi-Tower 3D-Sics

A Test Scheduling Method for Multi-Tower 3D-SIC Based on Quantum-Behaved Particle Swarm Optimization Algorithm

Scheduling Tests for 3D Stacked Chips under Power Constraints

Parallel test scheduling optimization method for three-dimensional chip with multi-core and multi-layer

New Dft Architectures for 3D-Sics with A Wireless Test Port

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

Integrated Test-Architecture Optimization and Thermal-Aware Test Scheduling for 3-D SoCs under Pre-Bond Test-Pin-Count Constraint

Solving the SOC test scheduling problem based on time-divided of IP test

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3d Ics with A Stacked Network-On-Chip

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

Memory Grouping for the Built-In Self-Test of Three-Dimensional Integrated Circuits

Test Architecture Design and Optimization for Three-Dimensional SoCs

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Layout-driven Test-Architecture Design and Optimization for 3D SoCs under Pre-Bond Test-Pin-count Constraint

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

System-Level Analysis of 3D ICs with Thermal TSVs