Abstract:Vertical integration (3D ICs) has demonstrated the potential to reduce inter-block wire latency through flexible block placement and routing. However, there is an untapped potential for 3D ICs to reduce intra-block wire latency through architectural designs that can leverage multiple silicon layers in innovative ways. Furthermore, it is particularly challenging to simultaneously explore the physical design space and microarchitectural space for vertical integration. The physical design space typically has no information on the microarchitectural impact of latency optimization, and the microarchitectural space has no information on the physical design impact of different architectural alternatives. We make the following contributions in this paper: (1) the introduction of port partitioning, a new approach to constructing multi-layer blocks; (2) the extension of a microarchitectural exploration tool to include the ability to model multilayer blocks and to consider these blocks as alternative implementations of single-layer architectural blocks on the fly, within a single floorplanning run; and (3) the evaluation of vertical integration on a design driver using this framework. For this design driver, we see an average 36% improvement in performance (measured in BIPS) over a single-layer architecture, and a 29% improvement in performance over a multi-layer architecture with single-layer blocks. The on-chip temperature is kept below 40°C.

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A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Scheduling Tests for 3D Stacked Chips under Power Constraints

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BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

A 3D Integration Testing Vehicle with TSV Interconnects

Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

System-Level Analysis of 3D ICs with Thermal TSVs

Testing 3D chips containing through-silicon vias

3D architecture modeling and exploration

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

A Case Study of Testing Strategy for AI SoC