Abstract:This paper presents a built-in self test (BIST) methodology, architecture and circuits for testing Through Silicon Vias (TSVs) in 3D-IC systems prior to stacking in order to improve 3D-IC yield and reduce overall test cost. A scan switch network (SSN) architecture is proposed to perform pre-bond TSV scan testing in test mode, and operate as functional circuit in functional mode, respectively. In the SSN, novel test structures and circuits are proposed to address pre-bond TSV test accessibility issue and perform stuck-at-fault tests and TSV tests. By exploiting the inherent RC delay characteristics of TSV, a novel delay-based TSV test method is also proposed to map the variation of TSV-to-substrate resistance due to TSV defects to a test path delay change. Compared with state-of-art methods, the proposed BIST methodology addresses pre-bond TSV testing with a low-overhead integrated test solution which is compatible to existing 2D-IC testing method. The proposed BIST architecture and method can be implemented by standard DFT design flow and integrated into a unified pre-bond TSV test flow. Experiment results and robustness analysis are presented to verify the effectiveness of the proposed self-test methodology, architecture, and circuits.

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

A Compressive-sensing based Testing Vehicle for 3D TSV Pre-bond and Post-bond Testing Data.

Adaptive 3D-IC TSV Fault Tolerance Structure Generation

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

Testing 3D chips containing through-silicon vias

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

An Optimization Algorithm for Pre-Bond TSV Probing Tests and Fault Localization

Scheduling Tests for 3D Stacked Chips under Power Constraints

A TSV Repair Method for Clustered Faults

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

A 3D Integration Testing Vehicle with TSV Interconnects

Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production