Abstract:As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters and higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within interposer substrates where mismatched coefficients of thermal expansion exacerbate issues. This study conducts a thermo-mechanical analysis of TSV structures within multi-layered complex interposers, and analyzes the thermal stress behavior and reliability under variable temperature conditions (-55 °C to 85 °C), taking into account the typical electroplating defects within the copper pillars in TSVs. Initially, an overall model is established to determine the critical TSV locations. Sub-model analysis is then employed to investigate the stress and deformation of the most critical TSV, enabling the calculation of the temperature cycle life accordingly. Results indicate that the most critical TSV resides centrally within the model, exhibiting the highest equivalent stress. During the temperature cycling process, the maximum deformation experiences approximately periodic variations, while the maximum equivalent stress undergoes continuous accumulation and gradually diminishes. Its peak occurs at the contact interface corner between the TSV and Redistribution Layer (RDL). The estimated life of the critical point is 3.1708 × 105 cycles. Furthermore, it is observed that electroplating defect b alleviates thermal stress within TSVs during temperature cycling. This study provides insights into TSV thermal behavior and reliability, which are crucial for optimizing the design and manufacturing processes of advanced semiconductor packaging.

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Post-bond Test for TSVs Using Voltage Division.

Fabrication and In-Situ Evaluation of Copper TSV Interconnection

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Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production

A Die Selection and Matching Method for Yield Enhancement of 3D-Stacked Memories

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

A BISR Scheme for 3D Stacked Memory by Sharing Adjacent Redundancy Cells Across Dies

Reliable Design of Electroplated Copper Through Silicon Vias

An Inter-Scale Simulation Method for TSV 3D IC Based on Linear Superposition Algorithm and TSV Model Sharing Strategy

2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling

Thermal–Mechanical and Signal Reliability of a New Differentiated TSV