Abstract:In 3-D integrated circuits (3-D ICs), through silicon via (TSV) is a critical technique to provide vertical connections. However, the yield and reliability challenge of TSV in industry is one of key obstacles to adopt the 3-D ICs technology. Various fault-tolerance structures by using additional spare TSVs (s-TSVs) to repair faulty functional TSVs (f-TSVs) have been proposed in literature for yield and reliability enhancement. However, these structures are formed in standard cell placement stage where all the f-TSVs are already placed. In reality, since the s-TSVs can be only inserted into the whitespace, the quality of the generated repair solution is strongly dependent on the whitespace distribution. In this paper, we propose an efficient TSV planning and repair framework in floorplanning stage, which takes nonuniform TSV distribution and clustered TSV defect-distribution into account. The proposed framework mainly consists of four stages: 1) a whitespace redistribution algorithm that uses a probability-based strategy to make the whitespace distribution more reasonable for the f-TSV planning. Subsequently, a convex-cost flow-based model for f-TSV allocation considering the fault clustering; 2) a top-down globally partitioning combined with a bottom-up locally merging to partition f-TSVs into groups with minimum hardware cost; 3) the min-cost max-flow algorithm for s-TSV allocation with minimum wirelength overhead; and 4) an integer linear programming-based model to form a fault-tolerance structure with minimum multiplexer delay overhead. The experimental results demonstrate that the proposed repair framework can improve the yield with minimum hardware cost and multiplexer delay overhead.

Adaptive 3D-IC TSV Fault Tolerance Structure Generation

Clustered Fault Tolerance TSV Planning for 3-D Integrated Circuits.

Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC

Fortune: A New Fault-Tolerance TSV Configuration in Router-Based Redundancy Structure

A New Cellular-Based Redundant TSV Structure for Clustered Faults

Yield and Reliability Enhancement for 3D ICs

On Effective Through-Silicon Via Repair for 3-D-stacked ICs

On Effective Tsv Repair For 3d-Stacked Ics

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

A TSV Fault-Tolerant Scheme Based on Failure Classification in 3D-Noc

Fault Detection and Redundancy Design for TSVs in 3D ICs.

A TSV Repair Method for Clustered Faults

Redundant TSV scheme using signal shifting based on chain design

TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test.

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Architecture of Cobweb-Based Redundant TSV for Clustered Faults

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis