Abstract:3D stacking of integrated circuits (ICs) provides significant advantages in saving device footprints, improving power management, and continuing performance enhancement, particularly for many-core systems. However, the stacked structure makes the heat dissipation a challenging issue. While Thermal Through Silicon Via (TTSV) is a promising way of lowering the thermal resistance of dies, past research has either overestimated or underestimated the effects of TTSVs as a consequence of the lack of detailed 3D IC models or system-level simulations. Here, we propose a simulation flow to accurately simulate TTSV effects on 3D ICs. We adopt benchmarks from Splash-2 running on a full-system mode of the gem5 simulator, which generates all the system component activities. McPAT is used to generate the corresponding power consumption and the power traces are fed to HotSpot for thermal simulation. The temperature profiles of 2D and 3D Nehalem-like ×86 processors are compared. TTSVs are later placed close to hotspot regions to facilitate heat dissipation; the peak temperature of 3D Nehalem is reduced by 5--25% with a small area overhead of 6%. By using a detailed 3D thermal model, full-system simulation, and a validated thermal simulator, our results show accurate thermal analysis of 3D ICs.

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing

A Compressive-sensing based Testing Vehicle for 3D TSV Pre-bond and Post-bond Testing Data.

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

An Optimization Algorithm for Pre-Bond TSV Probing Tests and Fault Localization

Novel LC resonant clocking for 3D IC using TSV-inductor and capacitor

Scheduling Tests for 3D Stacked Chips under Power Constraints

Yield-aware Time-Efficient Testing and Self-Fixing Design for TSV-based 3D ICs

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Three Dimensional ICs Thermal-Driven Test Application Scheme

3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs

System-Level Analysis of 3D ICs with Thermal TSVs

Session-Less Test Scheduling for Multi-Tower 3D-Sics

A 3D Integration Testing Vehicle with TSV Interconnects

A Prebond TSV Test Scheme Using Oscillator

A Cost-Driven Chip Partitioning Method for Heterogeneous 3D Integration